Kushandiswa kweSMT X-ray yekuongorora muchina- Testing Chips

Chinangwa uye nzira yekuongorora chip

Chinangwa chikuru chekuongorora chip ndechekuona zvinhu zvinokanganisa kunaka kwechigadzirwa mukuita kwekugadzira nekukurumidza sezvinobvira uye kudzivirira kunze-kwe-kushivirira batch kugadzirwa, kugadzirisa uye zvimedu.Iyi inzira yakakosha yechigadzirwa process quality control.X-RAY yekuongorora tekinoroji ine yemukati fluoroscopy inoshandiswa pakuongorora isina kukuvadza uye inowanzoshandiswa kuona kukanganisa kwakasiyana mumapakeji echip, senge layer peeling, kuputika, voids uye lead bond kutendeseka.Mukuwedzera, X-ray nondestructive inspection inogonawo kutarisa kukanganisa kunogona kuitika panguva yekugadzirwa kwePCB, zvakadai sekugadzirisa kusina kunaka kana kuvhurika kwebhiriji, shorts kana kubatanidza kusina kujairika, uye kuona kuvimbika kwemabhora anotengeswa mupakeji.Iyo haisi kungoona zvisingaoneki solder majoini, asiwo inoongorora mhedzisiro yekuongorora qualitatively uye quantitatively yekukurumidza kuona matambudziko.

Chip chekuongorora musimboti weX-ray tekinoroji

X-RAY yekuongorora michina inoshandisa X-ray chubhu kugadzira X-rays kuburikidza neiyo chip sample, iyo inofungidzirwa pane inogamuchira mufananidzo.Yayo yepamusoro-tsanangudzo yekufungidzira inogona kurongeka yakawedzerwa ne1000 nguva, nokudaro ichibvumira chimiro chemukati chechip kuti chiunzwe zvakajeka, ichipa nzira inoshanda yekuongorora kuvandudza "kamwe-kuburikidza mwero" uye kuzadzisa chinangwa che "zero. matambudziko”.

Muchokwadi, pamberi pemusika unotaridzika chaizvo asi chimiro chemukati cheaya machipisi ane hurema, zviri pachena kuti havagone kusiyaniswa neziso rakashama.Chete pasi pekuongororwa kweX-ray ndipo iyo "prototype" inogona kuratidzwa.Naizvozvo, X-ray yekuongorora michina inopa vimbiso yakakwana uye inoita basa rakakosha mukuyedzwa kwemachipisi mukugadzira zvigadzirwa zvemagetsi.

Zvakanakira zvePCB x ray muchina

1. Kuvharwa kwehuwandu hwekukanganiswa kwemaitiro kunosvika 97%.Izvo zvinokanganisa zvinogona kuongororwa zvinosanganisira: nhema solder, bridge connection, tablet stand, insufficient solder, air holes, device leakage nezvimwe zvakadaro.Kunyanya, X-RAY inogona zvakare kuongorora BGA, CSP uye mamwe solder akabatana akavanzika zvishandiso.

2. Higher test coverage.X-RAY, michina yekuongorora muSMT, inogona kuongorora nzvimbo dzisingagone kuongororwa neziso rakashama uye mu-mutsara bvunzo.Semuyenzaniso, iyo PCBA inofungidzirwa kuti ine mhosho, inofungidzirwa kuti ndiyo PCB yemukati yekumisikidza kurongeka, X-RAY inogona kukurumidza kuongororwa.

3. Nguva yekugadzirira yekuedzwa inoderedzwa zvikuru.

4. Inogona kuona kukanganisa kusingakwanisi kuonekwa nenzira yakavimbika nedzimwe nzira dzokuedza, dzakadai se: nhema solder, maburi emhepo uye kuumbwa kusina kunaka.

5. Chishandiso chekuongorora X-RAY yemapuranga ane mativi maviri uye akawanda-akawanda kamwe chete (ane delamination function).

6. Ipa ruzivo rwakakodzera rwekuyera runoshandiswa kuongorora maitiro ekugadzira muSMT.Senge solder paste ukobvu, huwandu hwe solder pasi pejoint solder, nezvimwe.