Mukuita kwePCBA kugadzirisa, kune akawanda maitiro ekugadzira, ayo ari nyore kuburitsa akawanda emhando matambudziko.Panguva ino, zvinodikanwa kugara uchivandudza PCBA welding nzira uye kuvandudza maitiro ekugadzirisa zvinobudirira kunaka kwechigadzirwa.
I. Kuvandudza tembiricha uye nguva yewelding
Iyo intermetallic bond pakati pemhangura netin inoumba zviyo, chimiro uye saizi yezviyo zvinoenderana nehurefu uye simba rekushisa kana uchitengesa midziyo yakadai se.reflow ovenkanawave soldering muchina.PCBA SMD yekugadzirisa maitiro nguva yakarebesa, ingave nekuda kwenguva refu yekuwodha kana nekuda kwekupisa kwakanyanya kana zvese zviri zviviri, zvinotungamira kune yakaoma crystal chimiro, chimiro chine matombo uye brittle, simba rekugera idiki.
II.Deredza kushushikana kwepamusoro
Tin-lead solder cohesion yakatokura kupfuura mvura, zvekuti solder ibhora rekudzikisa nzvimbo yaro (iyo vhoriyamu yakafanana, sphere ine nzvimbo diki yepasi kana ichienzaniswa nemamwe maumbirwo ejometri, kusangana nezvinodiwa zvepasi simba renyika. )Basa rekuyerera rakafanana nebasa rekuchenesa maajenti paplate resimbi rakaputirwa negirisi, nekuwedzera, kushushikana kwepamusoro kunoenderana zvakanyanya nehupamhi hwehutsanana hwepamusoro uye tembiricha, chete kana simba rekunamatira rakakura kupfuura pamusoro. simba (kubatana), iyo yakakodzera dip tin inogona kuitika.
III.PCBA bhodhi dip tin angle
Inenge 35 ℃ yakakwirira kudarika eutectic point tembiricha ye solder, kana donhwe remushonga rakaiswa panzvimbo inopisa yakavharwa neflux, mwedzi unokotama unoumbwa, nenzira, kugona kwesimbi kunyudza tini kunogona kuongororwa. nechimiro chemwedzi unokotama.Kana solder vachikotama mwedzi pamusoro ane pachena pazasi akachekwa kumucheto, rakaumbwa rakazorwa simbi ndiro pamusoro pemvura madonhwe, kana kunyange kuita spherical, simbi haisi solderable.Chete mwedzi wakakombama pamusoro akatambanudzwa mukona duku isingasviki 30. Chete zvakanaka weldability.
IV.Dambudziko reporosity rinogadzirwa ne welding
1. Kubika, PCB uye zvikamu zvakaratidzwa kumhepo kwenguva yakareba kubheka, kudzivirira unyoro.
2. Solder paste control, solder paste ine mwando inowanzoitika kune porosity, tin beads.Chokutanga pane zvose, shandisai zvakanaka solder paste, solder paste tempering, ichikurudzira maererano nekushanda kwekuita zvakasimba, solder paste yakazaruka kumhepo kwenguva pfupi sezvinobvira, mushure mekudhinda solder paste, kudiwa kwekugadzirisa nguva yekudzokazve.
3. Workshop humidity control, yakarongwa kutarisa hunyoro hwemusangano, kutonga pakati pe40-60%.
4. Seta inonzwisisika tembiricha curve, kaviri pazuva pamuyedzo wetembiricha yechoto, gadzirisa tembiricha yevira, tembiricha yekukwira haigone kukurumidza.
5. Flux spraying, mune pamusoroSMD wave soldering muchina, kuwanda kwekupfapfaidza kwemvura hakugone kuve kwakanyanya, kupfapfaidza zvine musoro.
6. Gadzirisa tembiricha yekupisa yechoto, tembiricha yenzvimbo yekupisa inoda kusangana nezvinodiwa, kwete kuderera zvakanyanya, kuitira kuti iyo flux inyatso kunyungudika, uye kumhanya kwechoto hakugone kukurumidza.
Nguva yekutumira: Jan-05-2022