1. Kurema kwebhodhi pachayo kuchaita kuti bhodhi kuora mwoyo deformation
Generalreflow ovenachashandisa cheni kutyaira bhodhi mberi, kureva, mativi maviri ebhodhi se fulcrum kutsigira bhodhi rose.
Kana pane zvikamu zvinorema zvakanyanya pabhodhi, kana hukuru hwebhodhi hwakanyanya, hucharatidza kuora mwoyo kwepakati nekuda kwehuremu hwayo, zvichiita kuti bhodhi rikotame.
2. Kudzika kweV-Cut uye tambo yekubatanidza ichakanganisa deformation yebhodhi.
Chaizvoizvo, V-Cut ndiyo inokonzera kuparadza chimiro chebhodhi, nokuti V-Cut ndeyekucheka grooves pane pepa guru rebhodhi rekutanga, saka nzvimbo yeV-Cut inowanzoita deformation.
Mhedzisiro yelamination zvinhu, chimiro uye magiraidhi pabhodhi deformation.
PCB bhodhi inogadzirwa nepakati bhodhi uye semi-yakaporeswa pepa uye yekunze yemhangura foil yakatsikirirwa pamwe chete, uko musimboti bhodhi uye foil yemhangura inokanganiswa nekupisa kana yakadzvanywa pamwe chete, uye huwandu hwe deformation hunoenderana neiyo coefficient yekuwedzera kwekupisa (CTE) ye zvinhu zviviri izvi.
Iyo coefficient of thermal expansion (CTE) yemhangura foil inenge 17X10-6;nepo Z-directional CTE yeyakajairwa FR-4 substrate iri (50~70) X10-6 pasi peTg poindi;(250 ~ 350) X10-6 pamusoro peTG point, uye X-directional CTE inowanzofanana neyemhangura foil nekuda kwekuvapo kwejira regirazi.
Deformation yakakonzerwa panguva yePCB board processing.
PCB board process process deformation zvikonzero zvakaoma kwazvo zvinogona kukamurwa kuita kupisa kwekushushikana uye kushushikana kwemagetsi kunokonzerwa nemhando mbiri dzekushushikana.
Pakati pavo, kushushikana kwekushisa kunonyanya kugadzirwa mukuita kwekudzvanya pamwe chete, kushushikana kwemagetsi kunonyanya kugadzirwa mubhodhi stacking, kubata, kubika maitiro.Inotevera ihurukuro pfupi yekutevedzana kwemaitiro.
1. Laminate zvinhu zvinopinda.
Laminate ane mativi maviri, symmetrical chimiro, hapana magirafu, foil yemhangura uye girazi jira CTE haina kunyanya kusiyana, saka mukuita kudzvanya pamwe chete hapana deformation inokonzerwa neCTE yakasiyana.
Nekudaro, hukuru hukuru hweiyo laminate press uye musiyano wetembiricha pakati penzvimbo dzakasiyana dzendiro inopisa zvinogona kutungamirira kune misiyano mishoma mukumhanya uye dhigirii rekurapa resin munzvimbo dzakasiyana dzelamination process, pamwe nekusiyana kwakakura mune inosimba viscosity. pamhando dzakasiyana dzekupisa, saka pachavawo nekunetseka kwenzvimbo nekuda kwekusiyana kwemaitiro ekurapa.
Kazhinji, kushushikana uku kuchachengetwa mukuenzana mushure mekucheneswa, asi kunozoburitswa zvishoma nezvishoma mune ramangwana kugadzirisa kuburitsa deformation.
2. Lamination.
PCB lamination process ndiyo nzira huru yekuburitsa kushushikana kwekupisa, kwakafanana nelaminate lamination, kuchaunzawo kushushikana kwenzvimbo kunounzwa nemusiyano mukurapa maitiro, PCB board nekuda kwekukora, graphic kugovera, mamwe semi-cured sheet, nezvimwe. kushushikana kwayo kwekupisa kuchavawo kwakaoma kubvisa kupfuura mhangura laminate.
Izvo zvinonetsa zviripo muPCB board zvinoburitswa mumatanho anotevera akadai sekuchera, kuumba kana grilling, zvichikonzera deformation yebhodhi.
3. Kubika maitiro akadai solder kuramba uye unhu.
Sezvo solder inorambira inki kurapa haigone kurongedzerwa pamusoro peimwe, saka PCB bhodhi ichaiswa yakatwasuka mune rack yekubikira bhodhi kurapa, solder kuramba tembiricha inosvika 150 ℃, pamusoro peiyo Tg point yezvinhu yakaderera Tg, Tg point. pamusoro pe resin yepamusoro elastic state, bhodhi iri nyore kushanduka pasi pekuita kwekuzvitakura kana hovha yakasimba yemhepo.
4. Kupisa kwemhepo solder kuenzana.
Ordinary board inopisa mhepo solder inoisa tembiricha yevira ye225 ℃ ~ 265 ℃, nguva ye3S-6S.kupisa kwemhepo tembiricha ye280 ℃ ~ 300 ℃.
Solder leveling board kubva mukamuri tembiricha kupinda muchoto, kunze kwechoto mukati memaminetsi maviri uyezve tembiricha yekamuri mushure mekugadzira mvura yekuwacha.Iyo yese inopisa mhepo solder yekuyera maitiro ekukurumidza kupisa uye kutonhora maitiro.
Nekuti iyo bhodhi zvinhu zvakasiyana, uye chimiro hachina yunifomu, mukupisa uye kutonhora maitiro anosungirirwa kune kushushikana kwekupisa, zvichikonzera micro-strain uye yakazara deformation warpage.
5. Kuchengeta.
PCB bhodhi mune semi-yapera nhanho yekuchengetera inowanzoiswa yakatwasuka musherufu, iyo sherufu tension gadziriso haina kukodzera, kana kuchengetedza maitiro akaturikidzana kuisa bhodhi kuchaita kuti bhodhi mechanical deformation.Kunyanya iyo 2.0mm pazasi peiyo yakaonda bhodhi kukanganisa kwakanyanya.
Pamusoro pezvinhu zviri pamusoro apa, pane zvakawanda zvinokanganisa PCB board deformation.
Nguva yekutumira: Sep-01-2022