Solder paste kudhinda mhinduro ye miniaturized components 3-2

Kuti tinzwisise zvinonetsa zvinounzwa ne miniaturized components kuti solder paste kudhinda, tinofanira kutanga tanzwisisa nharaunda reshiyo stencil kudhinda (Area Ratio).

Solder paste SMT

Kune solder paste kudhindwa kweminiaturized pads, iyo diki padhi uye stencil kuvhurwa, zvakanyanya kuoma kuti solder paste iparadzane kubva kune stencil hole wall.Kugadzirisa solder paste kudhindwa kweminiaturized pads, pane zvinotevera mhinduro. zvekutaura:

  1. Mhinduro yakananga ndeyekuderedza kuwanda kwesimbi mesh uye kuwedzera chiyero chenzvimbo yekuvhura.Sezvinoratidzwa mumufananidzo uri pasi apa, mushure mekushandisa mesh yakaonda yesimbi, kusungirirwa kwemapadhi ezvikamu zviduku zvakanaka.Kana iyo substrate inogadzirwa isina hukuru-hukuru zvikamu, saka iyi ndiyo iri nyore uye inoshanda mhinduro.Asi kana pane zvikamu zvakakura pane substrate, zvikamu zvakakura zvichange zvisina kutengeswa nekuda kwechidimbu chetini.Saka kana iri yepamusoro-musanganiswa substrate ine zvikamu zvakakura, tinoda dzimwe mhinduro dzakanyorwa pazasi.

SMT solder paste

  1. Shandisa tekinoroji nyowani mesh tekinoroji kudzikisa kudiwa kwereshiyo yekuvhura mune stencil.

1) FG (Fine Grain) stencil yesimbi

FG simbi pepa rine mhando ye niobium element, iyo inogona kunatsa zviyo uye kuderedza kuwedzeredza kwekunzwa uye kushatirwa kwesimbi, uye kugadzirisa simba.Iro gomba madziro e-laser-akachekwa FG simbi simbi yakachena uye yakapfava kupfuura iya yakajairwa 304 simbi pepa, iyo inonyanya kubatsira mukudhirowa.Iyo yekuvhura nzvimbo chiyero chesimbi mesh yakagadzirwa neFG simbi pepa inogona kunge yakaderera pane 0.65.Kuenzaniswa ne304 simbi mesh ine imwechete yekuvhura reshiyo, iyo FG simbi mesh inogona kuitwa yakakora zvishoma kupfuura iyo 304 simbi mesh, nekudaro ichidzikisa njodzi yemarata mashoma kune makuru makomba.

SMT


Nguva yekutumira: Aug-05-2020

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