SMT ruzivo rwekutanga
1. Surface Mount Technology-SMT (Surface Mount Technology)
Chii chinonzi SMT:
Kazhinji inoreva kushandiswa kwemidziyo yekugadzira otomatiki kubatanidza zvakananga uye solder chip-mhando uye miniaturized isina lead kana pfupi-lead pamusoro pemasevhisi zvikamu/midziyo (inonzi SMC/SMD, inowanzonzi chip components) pamusoro peyakadhindwa redunhu bhodhi. (PCB) Kana imwe tekinoroji yekubatanidza yemagetsi pane yakatsanangurwa chinzvimbo pamusoro peiyo substrate, inozivikanwawo seyepamusoro Mount tekinoroji kana yepamusoro Mount tekinoroji, inonzi SMT (Surface Mount Technology).
SMT (Surface Mount Technology) iri kusimukira maindasitiri tekinoroji muindasitiri yemagetsi.Kusimuka kwayo uye kukurumidza kusimudzira iko shanduko muindasitiri yegungano remagetsi.Iyo inozivikanwa se "Rising Star" yeindasitiri yemagetsi.Inoita kuti gungano remagetsi riwedzere uye Inokurumidza uye iri nyore, iyo inokurumidza uye nekukurumidza kutsiva kweakasiyana zvigadzirwa zvemagetsi, iyo yakakwirira yekubatanidza nhanho, uye yakachipa mutengo, vakaita mupiro wakakura mukusimudzira nekukurumidza kweIT. Information Technology) indasitiri.
Surface Mount tekinoroji inogadzirwa kubva kune yekugadzira tekinoroji yezvikamu maseketi.Kubva 1957 kusvika parizvino, kusimukira kweSMT kwapfuura nematanho matatu:
Danho rekutanga (1970-1975): Chinangwa chikuru chehunyanzvi ndechekushandisa miniaturized chip zvikamu mukugadzira nekugadzirwa kwemagetsi akasanganiswa (anonzi makobvu emafirimu maseketi muChina).Kubva pakuona uku, SMT inonyanya kukosha pakubatanidza Nzira yekugadzira uye teknolojia yekugadzirwa kwematunhu yakaita zvipo zvakakosha;panguva imwecheteyo, SMT yakatanga kushandiswa zvakanyanya muzvigadzirwa zvevagari vemo senge quartz electronic watches uye electronic calculators.
Chikamu chechipiri (1976-1985): kukurudzira kukurumidza miniaturization uye multi-functionalization yezvigadzirwa zvemagetsi, uye yakatanga kushandiswa zvakanyanya muzvigadzirwa zvakadai semavhidhiyo makamera, mahedhifoni eredhiyo uye makamera emagetsi;panguva imwecheteyo, nhamba huru yezvigadzirwa zvemagetsi zvekusangana kwepamusoro zvakagadziridzwa Mushure mekugadzirwa, teknolojia yekuisa uye zvigadzirwa zvekutsigira zvezvikamu zvechiputi zvakave zvakakurawo, zvichiisa nheyo yekukura kukuru kwe SMT.
Nhanho yechitatu (1986-ikozvino): Chinangwa chikuru ndechekuderedza mari uye kuwedzera kuvandudza chiyero chekushanda-mutengo wezvigadzirwa zvemagetsi.Nekukura kwehunyanzvi hweSMT tekinoroji uye kuvandudzwa kwemaitiro ekuvimbika, zvigadzirwa zvemagetsi zvinoshandiswa mumauto nekudyara (motokari yekombuta yekukurukurirana midziyo yeindasitiri) minda yakagadzira nekukurumidza.Panguva imwecheteyo, nhamba huru yezvigadziriso zvekugadzira zvigadziriswe uye nzira dzekugadzirisa dzakabuda kuti dzigadzire chip components Kukura kwekukurumidza mukushandiswa kwePCBs kwakawedzera kuderera kwemari yose yezvigadzirwa zvemagetsi.
2. Zvinoumba SMT:
①Yakakwira gungano density, saizi diki uye huremu huremu hwezvigadzirwa zvemagetsi.Huwandu uye huremu hwezvinhu zveSMD zvinongosvika 1/10 zvechinyakare plug-in zvikamu.Kazhinji, mushure mekunge SMT yagamuchirwa, huwandu hwezvigadzirwa zvemagetsi hunoderedzwa ne40% ~ 60% uye uremu hunoderedzwa ne60%.~80%.
②Kuvimbika kwepamusoro, kwakasimba anti-vibration kugona, uye yakaderera solder joint defect rate.
③Yakanaka yakakwirira frequency maitiro, kuderedza electromagnetic uye redhiyo frequency kukanganisa.
④ Zviri nyore kuona otomatiki uye kugadzirisa kugadzirwa kwakanaka.
⑤Chengetedza zvinhu, simba, midziyo, vashandi, nguva, nezvimwe.
3. Kurongeka kwemaitiro ekukwira kwepamusoro: Maererano nemaitiro akasiyana eSMT, SMT yakakamurwa kuva nzira yekuparadzira (wave soldering) uye solder paste process (reflow soldering).
Misiyano yavo mikuru ndeiyi:
① Maitiro asati apeta akasiyana.Iyo yekutanga inoshandisa chigamba glue uye yekupedzisira inoshandisa solder paste.
②Maitirwo mushure mekucheka akasiyana.Iyo yekutanga inopfuura nemuovheni inoyerera kuti irape glue uye isa zvinhu kuPCB board.Wave soldering inodiwa;iyo yekupedzisira inopfuura nepakati pevheni reflow for soldering.
4. Zvinoenderana nemaitiro eSMT, inogona kukamurwa kuita mhando dzinotevera: single-sided mounting process, kaviri-sided mounting process, kaviri-sided kusanganiswa kurongedza process.
① Unganidza uchishandisa chete pamusoro peiyo mount components
A. Gungano rine divi rimwechete rine kukwidzwa kwepamusoro chete (kuiswa kwedivi rimwe chete) Maitirwo: sikirini inodhinda solder namira → zvinoiswa zvinoiswa → reflow solder
B. Gungano rine mativi maviri rinoiswa pamusoro chete (kukwirisa mativi maviri) Maitirwo: sikirini inodhinda solder namira → zvinokurisa zvinoiswa → reflow soldering → divi reshure → sikirini inodhinda solder namira → zvinokurisa → reflow solder
② Unganidza nepamusoro pezvivakwa zvekumusoro kune rimwe divi uye musanganiswa wepamusoro pezvimedu zvekumusoro uye maburi emukati kune rimwe divi (kaviri-mativi akasanganiswa musangano maitiro)
Maitiro 1: Sikirini inodhinda solder namira (parutivi rwepamusoro) → zvinokurisa zvinoiswa → reflow soldering → reverse side → kugovera (pazasi) → zvinoiswa zvinoiswa (pazasi) → zvinoiswa zvinoiswa → kupisa kwakanyanya kupora → divi rekudzokera kumashure → zvinoiswa nemaoko → wave soldering
Maitiro 2: Sikirini inodhinda solder paste (parutivi rwepamusoro) → zvinokurisa zvinoiswa → reflow soldering → muchina plug-in (kumusoro divi) → reverse side → kugovera (pazasi side) → chigamba → kupisa kwakanyanya kupora → wave soldering
③Pamusoro panoshandisa peforated components uye pasi pepasi panoshandisa pamusoro pegomo components (double-sided mixed assembly process)
Maitiro 1: Kuparadzira → kukwirisa zvinhu → kupisa kwakanyanya kupora → divi rekudzokera kumashure → kuisa ruoko → wave soldering
Maitiro 2: Muchina plug-in → reverse side → kugovera → chigamba → kupisa kwakanyanya kupora → wave soldering
Specific process
1. Single-sided surface assembly process flow Isa solder paste kuti uise zvinhu uye reflow soldering.
2. Kuyerera kwemaviri-sided surface assembly process A Divi rinoisa solder paste pakuisa zvinhu uye reflow soldering flap B side rinoisa solder paste pakuisa zvinhu uye reflow soldering.
3. Single-sided mixed assembly (SMD neTHC zviri kudivi rimwe) A side rinoshandisa solder paste kugomo SMD reflow soldering A side interposing THC B side wave soldering.
4. Single-sided mixed assembly (SMD neTHC zviri kumativi ose ePCB) Isa SMD inonamira padivi reB kuti uise SMD inonamira yekurapa flap A side isa THC B side wave solder.
5. Kusungirirwa kwakasanganiswa kwemativi maviri (THC iri kudivi A, mativi ese A neB ane SMD) Isa solder paste kudivi A kuti uise SMD wobva wayerera solder pafiripi board B side isa SMD guruu kuisa SMD guruu kurapa pafiripi board A. divi rekuisa THC B Surface wave soldering
6. Kaviri-sided yakasanganiswa musangano (SMD neTHC kumativi ese eA neB) Rutivi shandisa solder paste kukwira SMD reflow soldering flap B side isa SMD guruu inokwirisa SMD guruu inorapa flap A side isa THC B side wave soldering B- side manual welding
Fives.SMT chikamu ruzivo
Inowanzo shandiswa SMT chikamu mhando:
1. Surface mount resistors uye potentiometers: rectangular chip resistors, cylindrical fixed resistors, zviduku zvakagadziriswa zvigadziriswe, chip potentiometers.
2. Surface mount capacitors: multilayer chip ceramic capacitors, tantalum electrolytic capacitors, aluminium electrolytic capacitors, mica capacitors
3. Surface mount inductors: waya-ronda chip inductors, multilayer chip inductors.
4. Magnetic beads: Chip Bead, Multilayer Chip Bead
5. Zvimwe zvikamu zve chip: chip multilayer varistor, chip thermistor, chip surface wave filter, chip multilayer LC filter, chip multilayer delay line
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Nguva yekutumira: Jul-23-2020