41. PLCC (plastic leaded chip carrier)
Plastic chip carrier ine mitungamiriri.Imwe yepamusoro Mount package.Mapini anoburitswa kubva kumativi mana epasuru, ari muchimiro che ding, uye ari epurasitiki zvigadzirwa.Yakatanga kugamuchirwa neTexas Instruments muUnited States ye64k-bit DRAM uye 256kDRAM, uye yava kushandiswa zvakanyanya mumaseketi akadai se logic LSIs uye DLDs (kana process logic zvishandiso).Iyo pini yepakati kureba ndeye 1.27mm uye nhamba yepini inotangira kubva 18 kusvika 84. Mapini akafanana neJ haanyanye kukanganisa uye ari nyore kubata kupfuura maQFPs, asi kuongorora kwezvizoro mushure mekutengesa kunonyanya kuoma.PLCC yakafanana neLCC (inozivikanwawo seQFN).Pakutanga, mutsauko chete pakati pezviviri waiva wekuti yekutanga yakagadzirwa nepurasitiki uye yekupedzisira yakagadzirwa nekeramic.Nekudaro, ikozvino kune mapakeji akaita J akagadzirwa neceramic uye pinless mapakeji akagadzirwa epurasitiki (akamisikidzwa sepurasitiki LCC, PC LP, P-LCC, nezvimwewo), izvo zvisingazivikanwe.
42. P-LCC (plastic teadless chip carrier) (plastic leadedchip currier)
Dzimwe nguva iri zita repurasitiki QFJ, dzimwe nguva iri zita reQFN (plastic LCC) (ona QFJ neQFN).Vamwe vagadziri veLSI vanoshandisa PLCC ye leaded package uye P-LCC yepasuru isina lead kuratidza mutsauko.
43. QFH (quad flat high package)
Quad flat package ine gobvu mapini.Rudzi rwepurasitiki QFP umo muviri weQFP unogadzirwa mukobvu kudzivirira kuputsika kwepakeji body (ona QFP).Iro zita rinoshandiswa nevamwe vanogadzira semiconductor.
44. QFI (quad flat I-lead packgac)
Quad flat I-inotungamira package.Imwe yemapakeji epamusoro pegomo.Mapini anotungamirwa kubva kumativi mana epasuru mune I-yakaita yakadzika nzira.Inonziwo MSP (ona MSP).Iyo gomo inobata-inotengeswa kune yakadhindwa substrate.Sezvo mapini asingabudi, iyo inokwira tsoka idiki pane iyo yeQFP.
45. QFJ (quad flat J-lead pasuru)
Quad flat J-inotungamira pasuru.Imwe yemapakeji epamusoro pegomo.Mapini anotungamirwa kubva kumativi mana epasuru mune J-chimiro zvichidzika.Iri ndiro zita rakatsanangurwa neJapan Electrical and Mechanical Manufacturers Association.Iyo pini yepakati kureba ndeye 1.27mm.
Kune marudzi maviri ezvigadzirwa: plastiki uye ceramic.Plastic QFJs inonyanya kunzi PLCCs (ona PLCC) uye inoshandiswa mumasekete akadai semakomputa, maratidziro emagedhi, DRAMs, ASSPs, OTPs, nezvimwewo. Pin kuverenga kubva ku18 kusvika ku84.
Ceramic QFJs inozivikanwawo seCLCC, JLCC (ona CLCC).Windowed mapakeji anoshandiswa kune UV-kudzima EPROMs uye microcomputer chip maseketi ane EPROMs.Pini kuverenga kubva pa32 kusvika ku84.
46. QFN (quad flat non-lead pasuru)
Quad flat isina-lead pasuru.Imwe yemapakeji epamusoro pegomo.Mazuva ano, inonyanya kunzi LCC, uye QFN izita rakatsanangurwa neJapan Electrical and Mechanical Manufacturers Association.Iyo pasuru inoshongedzerwa nemagetsi emagetsi pamativi ese mana, uye nekuti haina mapini, nzvimbo yekumisikidza idiki pane QFP uye kureba kwakadzikira pane QFP.Nekudaro, kana kushushikana kuchigadzirwa pakati peiyo yakadhindwa substrate uye pasuru, haigone kudzikiswa pamagetsi emagetsi.Nokudaro, zvakaoma kuita akawanda emagetsi emagetsi semapini eQFP, ayo anowanzobva pa14 kusvika ku100. Kune marudzi maviri ezvigadzirwa: ceramic uye plastiki.Ma electrode contact centers ari 1.27 mm apart.
Plastiki QFN pasuru ine mutengo wakaderera ine epoxy yakadhindwa substrate base.Pamusoro pe 1.27mm, kune zvakare 0.65mm uye 0.5mm electrode contact centre kureba.Iyi pasuru inonziwo plastiki LCC, PCLC, P-LCC, nezvimwe.
47. QFP (quad flat package)
Quad flat package.Imwe yemapaketi epamusoro pegomo, mapini anotungamirwa kubva kumativi mana mune seagull bapiro (L) chimiro.Kune marudzi matatu e substrates: ceramic, simbi uye plastiki.Panyaya yehuwandu, mapakeji epurasitiki anoumba ruzhinji.Plastiki QFPs ndiwo anonyanya kufarirwa akawanda-pini LSI package kana zvinhu zvisina kuratidzwa.Iyo haishandiswe kwete chete kudhijitari logic LSI maseketi akadai semicroprocessors uye gedhi kuratidzwa, asiwo kune analog LSI maseketi akadai seVTR chiratidzo chekugadzirisa uye odhiyo chiratidzo chekugadzirisa.Nhamba yepamusoro yepini mu 0.65mm yepakati pitch ndeye 304.
48. QFP (FP) (QFP yakanaka pitch)
QFP (QFP yakanaka pitch) ndiro zita rinotsanangurwa muJEM standard.Inoreva maQFP ane pini yepakati kureba kwe0.55mm, 0.4mm, 0.3mm, nezvimwewo isingasviki 0.65mm.
49. QIC (quad in-line ceramic package)
Iyo alias ye ceramic QFP.Vamwe vanogadzira semiconductor vanoshandisa zita (ona QFP, Cerquad).
50. QIP (quad in-line plastic package)
Alias yepurasitiki QFP.Vamwe vanogadzira semiconductor vanoshandisa zita (ona QFP).
51. QTCP (quad tape carrier package)
Imwe yemapakeji eTCP, umo mapini anoumbwa patepi inodzivirira uye anotungamira kubva kumativi mana epakeji.Ipasuru yakatetepa inoshandisa tekinoroji yeTAB.
52. QTP (quad tape carrier package)
Quad tepi inotakura package.Zita rinoshandiswa kuQTCP fomu factor yakatangwa neJapan Electrical and Mechanical Manufacturers Association muna Kubvumbi 1993 (ona TCP).
53, QUIL(quad in-line)
Zita rezita reQUIP (ona QUIP).
54. QUIP (quad in-line package)
Quad in-line package ine mitsara mina yemapini.Mapini anotungamirwa kubva kumativi ese epasuru uye anodzedzereka uye akakotama pasi kuita mitsara mina imwe neimwe.Iyo pini yepakati kureba ndeye 1.27mm, kana yaiswa muchikamu chakadhindwa, nzvimbo yepakati inova 2.5mm, saka inogona kushandiswa mumabhodhi akadhindwa edunhu.Ipasuru diki pane yakajairika DIP.Aya mapakeji anoshandiswa neNEC kune microcomputer machipisi mumakomputa edesktop uye midziyo yemumba.Kune marudzi maviri ezvigadzirwa: ceramic uye plastiki.Nhamba yepini i64.
55. SDIP (shrink dual in-line package)
Imwe yemapaketi e cartridge, chimiro chakafanana neDIP, asi pini yepakati kureba (1.778 mm) idiki pane DIP (2.54 mm), saka zita.Nhamba yepini inotangira pa14 kusvika pa90, uye inonziwo SH-DIP.Kune marudzi maviri ezvigadzirwa: ceramic uye plastiki.
56. SH-DIP (shrink dual in-line package)
Zvakafanana ne SDIP, zita rinoshandiswa nevamwe vanogadzira semiconductor.
57. SIL (single in-line)
Iri zita reSIP (ona SIP).Iro zita SIL rinonyanya kushandiswa nevagadziri veEuropean semiconductor.
58. SIMM (single in-line memory module)
Imwe mu-mutsara memory module.A memory module ine maelectrodes padyo nedivi rimwe chete reiyo substrate yakadhindwa.Kazhinji zvinoreva chikamu chinopinzwa musoketi.MaSIMM akajairwa anowanikwa aine maelectrodes makumi matatu ari 2.54mm centre kureba uye makumi manomwe nemaviri emagetsi ari 1.27mm pakati chinhambwe.MaSIMM ane 1 uye 4 megabit DRAMs mumapakeji eSOJ kune rimwe kana mativi ese maviri e substrate yakadhindwa anoshandiswa zvakanyanya mumakomputa emunhu, nzvimbo dzekushandira, uye zvimwe zvishandiso.Angangoita 30-40% yeDRAMs akaunganidzwa muSIMMs.
59. SIP (pasuru imwe chete mumutsara)
Single in-line package.Mapini anotungamirwa kubva kune rumwe rutivi rwepakeji uye akarongwa mumutsara wakatwasuka.Kana yakaunganidzwa pane yakadhindwa substrate, iyo pasuru iri padivi-yakamira chinzvimbo.Iyo pini yepakati kureba inowanzoita 2.54mm uye huwandu hwepini hunotangira pa2 kusvika pa23, kazhinji mumapakeji etsika.Chimiro chepasuru chinosiyana.Mamwe mapakeji ane chimiro chakafanana neZIP anonzi zvakare SIP.
60. SK-DIP (skinny dual in-line package)
Mhando yeDIP.Inoreva DIP nhete ine hupamhi hwe7.62mm uye pini yepakati chinhambwe che2.54mm, uye inowanzonzi DIP (ona DIP).
61. SL-DIP (slim dual in-line package)
Mhando yeDIP.Iyo DIP nhete ine hupamhi hwe10.16mm uye pini yepakati chinhambwe che2.54mm, uye inowanzonzi DIP.
62. SMD (zvishandiso zvekukwira pamusoro)
Surface Mount zvishandiso.Dzimwe nguva, vamwe vanogadzira semiconductor vanoisa SOP seSMD (ona SOP).
63. SO (diki out-line)
SOP's alias.Iri zita rinoshandiswa nevazhinji semiconductor vagadziri pasi rese.(Ona SOP).
64. SOI (diki-mutsetse I-inotungamira pasuru)
I-shaped pini diki kunze-mutsara package.Imwe yekumusoro kwegomo packs.Mapini anotungamirwa achidzika pasi kubva kumativi ese epasuru mune I-chimiro chine nzvimbo yepakati ye1.27mm, uye nzvimbo yekumisikidza idiki pane iyo yeSOP.Nhamba yepini 26.
65. SOIC (diki kunze-line integrated circuit)
Iri zita reSOP (ona SOP).Vazhinji vagadziri vekunze semiconductor vatora zita iri.
66. SOJ (Small Out-Line J-Leaded Package)
J-yakaita pini diki reratidziro pasuru.Imwe yepamusoro Mount package.Pini kubva kumativi ese epakeji inotungamira pasi kune J-yakaumbwa, yakadanwa kudaro.DRAM zvishandiso muSO J mapakeji anonyanya kuunganidzwa paSIMMs.Iyo pini yepakati kureba ndeye 1.27mm uye nhamba yemapini inotangira pa20 kusvika pa40 (ona SIMM).
67. SQL (Diki Out-Line L-inotungamira pasuru)
Zvinoenderana neJEDEC (Joint Electronic Device Engineering Council) chiyero cheSOP yakagamuchirwa zita (ona SOP).
68. SONF (Small Out-Line Non-Fin)
SOP isina singi yekupisa, yakafanana neyakajairika SOP.Iyo NF (isina-fin) mucherechedzo wakawedzerwa nemaune kuratidza mutsauko musimba IC mapakeji pasina kupisa singi.Zita rinoshandiswa nevamwe vanogadzira semiconductor (ona SOP).
69. SOF (diki Out-Line package)
Diki Outline Package.Imwe yemapasuru epamusoro pepakeji, mapini anoburitswa kubva kumativi ese epasuru muchimiro chemapapiro egungwa (L-akaumbwa).Kune marudzi maviri ezvigadzirwa: plastiki uye ceramic.Iyo inozivikanwawo seSOL uye DFP.
SOP haishandiswe kwete yekurangarira LSI chete, asiwo yeASSP uye mamwe maseketi asina kunyanyokura.SOP ndiyo inonyanya kufarirwa pamusoro pepakiti yekumisikidza mumunda umo iyo yekupinza uye yekubuda materminal haipfuuri 10 kusvika 40. Iyo pini yepakati kureba ndeye 1.27mm, uye nhamba yepini inotangira pa8 kusvika 44.
Mukuwedzera, maSOP ane pini centre kureba isingasviki 1.27mm anonziwo SSOPs;MaSOP ane kureba kwegungano asingasviki 1.27mm anonziwo TSOPs (ona SSOP, TSOP).Kune zvakare SOP ine singi yekupisa.
70. SOW (Small Outline Package (Wide-Jype)
Nguva yekutumira: May-30-2022