5. Delamination
Delamination kana kusabatana kwakashata kunoreva kupatsanurwa pakati pepurasitiki sealer uye iri padyo nezvinhu interface.Delamination inogona kuitika munzvimbo ipi neipi yakaumbwa microelectronic device;inogonawo kuitika panguva ye encapsulation process, post-encapsulation kugadzira chikamu, kana panguva yechishandiso chikamu chekushandisa.
Husina kunaka bonding interfaces inokonzerwa neiyo encapsulation process chinhu chikuru muku delamination.Interface voids, kusvibiswa kwepasi panguva yekuvharirwa, uye kusakwana kurapwa zvese zvinogona kutungamirira mukusabatana zvakanaka.Zvimwe zvinofurira zvinhu zvinosanganisira shrinkage kusagadzikana uye warpage panguva yekurapa uye kutonhora.Kusawirirana kweCTE pakati pepurasitiki sealer uye zvinhu zviri padyo panguva yekutonhora zvinogona zvakare kutungamira kune yekupisa-mechanicha kusagadzikana, izvo zvinogona kukonzera delamination.
6. Voids
Voids inogona kuitika pane chero nhanho ye encapsulation process, kusanganisira kutamisa kuumba, kuzadza, kuputira, uye kudhindwa kwekomboni yekuumba munzvimbo yemhepo.Voids inogona kuderedzwa nekudzikisa huwandu hwemhepo, sekubuda kana vacuuming.Vacuum dzvinyiriro kubva pa1 kusvika ku300 Torr (760 Torr yemhepo imwe chete) inonzi inoshandiswa.
Kuongorora kwekuzadza kunoratidza kuti iko kubata kwepasi kunyungudika kumberi nechip iyo inoita kuti kuyerera kuvharwe.Chikamu chepamberi chekunyunguduka chinoyerera chichikwira kumusoro uye chinozadza pamusoro pehafu kufa kuburikidza nenzvimbo huru yakavhurika padivi peiyo chip.Iyo ichangobva kuumbwa yakanyunguduka kumberi uye adsorbed yakanyungudika kumberi inopinda pamusoro penzvimbo yehafu inofa, zvichikonzera kuputika.
7. Kurongedza kusina kuenzana
Non-uniform package ukobvu kunogona kutungamira kune warpage uye delamination.Matekinoroji ekurongedza matekinoroji, akadai sekutamisa kuumbwa, kuumbwa kwekumanikidza, uye matekinoroji ekuputira matekinoroji, haadiki kuburitsa hurema hwekurongedza nehusina-uniform ukobvu.Wafer-level packaging inonyanya kubatwa nekusaenzana kweplastisol ukobvu nekuda kwemaitiro ayo maitiro.
Kuti ive nechokwadi chekukora chisimbiso chakafanana, mutakuri wewafer unofanirwa kumiswa nekurereka kushoma kufambisa squeegee kukwira.Uye zvakare, squeegee chinzvimbo chekutonga chinodiwa kuve nechokwadi chakagadzikana squeegee kudzvanywa kuti uwane yunifomu chisimbiso ukobvu.
Heterogeneous kana inhomogeneous zvinhu kuumbwa kunogona kuguma kana zvimedu zvekuzadza zvinoungana munzvimbo dzenzvimbo dzemuumbi wekuumba uye kugadzira kugovera kusiri-yunifomu kusati kwaoma.Kusakwana kusanganiswa kwepurasitiki sealer kunotungamira mukuitika kwemhando dzakasiyana mu encapsulation uye potting process.
8. Raw edge
Burrs ipurasitiki yakaumbwa inopfuura nemutsetse wekuparadzanisa uye inoiswa pamapini emudziyo panguva yekuumbwa.
Kusakwana clamping pressure ndiyo inonyanya kukonzera burrs.Kana iyo yakaumbwa zvinhu zvakasara pamapini zvisina kubviswa nenguva, zvinotungamira kumatambudziko akasiyana muchikamu chegungano.Semuenzaniso, kusakwana kwekubatana kana kunamatira mune inotevera yekurongedza nhanho.Resin leakage ndiyo yakatetepa fomu yemaburrs.
9. Zvimedu zvekunze
Mukuita kwekurongedza, kana zvinhu zvekurongedza zvakafumurwa kune yakasvibiswa nharaunda, zvishandiso kana zvinhu, zvimedu zvekunze zvinopararira mupakeji uye zvinounganidza pazvikamu zvesimbi mukati mepakeji (senge IC machipisi uye lead bonding point), zvichitungamira mukuora uye zvimwe. matambudziko anotevera ekuvimbika.
10. Kurapwa kusina kukwana
Nguva isina kukwana yekurapa kana tembiricha yekurapa yakaderera inogona kutungamirira mukusakwana kurapwa.Mukuwedzera, kushanduka kuduku muhuwandu hwekusanganiswa pakati pezvinyorwa zviviri zvinotungamirira kukurapa kusina kukwana.Kuti uwedzere zvinhu zve encapsulant, zvakakosha kuve nechokwadi kuti encapsulant inorapwa zvakakwana.Mune nzira dzakawanda dzekuisa encapsulation, post-curing inobvumirwa kuve nechokwadi chekurapa kwakakwana kweiyo encapsulant.Uye kutarisirwa kunofanira kutorwa kuve nechokwadi chekuti encapsulant ratios yakanyatso kuenzaniswa.
Nguva yekutumira: Feb-15-2023