Chip Chikamu Pad Dhizaini Kukanganisa

1. 0.5mm pitch QFP pad kureba kwakarebesa, zvichikonzera pfupi pfupi.

2. PLCC socket pads ipfupi, zvichiita kuti manyepo soldering.

3. Pad kureba kweIC kwakarebesa uye kuwanda kwesolder paste yakakura zvichikonzera pfupi pfupi pakuyerera.

4. Wing chip pads akareba anokanganisa chitsitsinho solder kuzadza uye kunyorova chitsitsinho.

5. Iyo pad kureba kweiyo chip zvikamu ipfupi, zvichikonzera matambudziko ekutengesa senge kuchinjika, kuvhurika dunhu, uye kusakwanisa solder.

6. Kureba kwakarebesa kwechip component pads kunokonzera matambudziko ekutengesa akadai sekumira monument, rakavhurika redunhu, uye shoma tin mumasolder joints.

7. Iyo pad wide yakapamhama zvakanyanya zvichikonzera kukanganisa senge component displacement, isina chinhu solder uye isina kukwana tin padhi.

8. Iyo pad wide yakawandisa uye chikamu chepasuru saizi haienderane nepedhi.

9. Solder pad width idiki, inokanganisa saizi yesolder yakanyungudutswa padivi pechikamu chekupedzisira uye PCB mapedhi pakusanganiswa kwesimbi yepasi yekunyorova kupararira inogona kusvika, inokanganisa chimiro chejoint ye solder, kuderedza kuvimbika kweiyo solder joint. .

10.Solder pads akabatana zvakananga kunzvimbo huru dzemhangura foil, zvichikonzera kukanganisa kwakadai semamonuments akamira uye soldering yenhema.

11. Solder pad pitch yakakurisa kana kuti idiki kwazvo, iyo component solder end haigone kupindirana nepedhi inopindirana, iyo inoburitsa kuremara senge yakamira monument, displacement, uye manyepo soldering.

12. Solder pad spacing yakakurisa zvichikonzera kusakwanisa kuumba masolder joints.

K1830 SMT yekugadzira mutsara


Nguva yekutumira: Jan-14-2022

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