Chinangwa che semiconductor chip kurongedza ndechekudzivirira iyo chip pachayo uye kubatanidza masaini pakati pemachipisi.Kwenguva yakareba munguva yakapfuura, kuvandudzwa kwekushanda kwechips kwainyanya kuvimba nekuvandudzwa kwekugadzira uye kugadzira maitiro.
Nekudaro, sezvo iyo transistor chimiro chesemiconductor machipisi chakapinda munguva yeFinFET, kufambira mberi kweiyo process node kwakaratidza kudzikira kwakanyanya mumamiriro ezvinhu.Kunyangwe zvichienderana nebudiriro yeindasitiri nzira, kuchine nzvimbo yakawanda yekuti process node iteration isimuke, tinogona kunyatsonzwa kudzikira kweMutemo waMoore, pamwe nekumanikidzwa kwakaunzwa nekukwira kwemitengo yekugadzira.
Nekuda kweizvozvo, yave nzira yakakosha yekuenderera mberi nekuongorora mukana wekuvandudza kwekuita nekugadzirisa tekinoroji yekurongedza.Makore mashoma apfuura, indasitiri yakabuda kuburikidza nehunyanzvi hwekurongedza kumberi kuti uone sirogani "kupfuura Moore (Kupfuura Moore)"!
Iyo inonzi yakakwira yekurongedza, iyo indasitiri yakajairika tsananguro ndeiyi: zvese kushandiswa kwepamberi-chiteshi kugadzira nzira dzekugadzira tekinoroji.
Kuburikidza nekurongedza kwepamberi, tinogona:
1. Zvinonyanya kuderedza nzvimbo ye chip mushure mekuvhara
Kunyangwe iri musanganiswa wemachipi akawanda, kana imwechete chip Wafer Levelization package, inogona kuderedza zvakanyanya saizi yepakeji kuitira kudzikisa kushandiswa kweiyo system system board nzvimbo.Kushandiswa kwekuputira kunoreva kuderedza chip nzvimbo muhupfumi pane kusimudzira nzira yekumberi-yekupedzisira kuti ive inodhura.
2. Gadzira mamwe chip I / O ports
Nekuda kwekuunzwa kweyekumberi-yekupedzisira maitiro, isu tinokwanisa kushandisa RDL tekinoroji kugarisa mamwe mapini eI / O pachikamu chechikamu cheiyo chip, nokudaro kuderedza kuparara kwechip area.
3. Deredza mari yose yekugadzira chip
Nekuda kwekuunzwa kweChiplet, isu tinogona nyore kusanganisa akawanda machipi ane akasiyana mabasa uye maitiro matekinoroji / node kugadzira system-mu-package (SIP).Izvi zvinodzivirira nzira inodhura yekushandisa yakafanana (yepamusoro maitiro) kune ese mabasa uye IPs.
4. Enhance interconnectivity pakati machipisi
Sezvo kudiwa kwesimba rakakura remakomputa kuchiwedzera, mune dzakawanda zvekushandisa zvinodikanwa kuti komputa unit (CPU, GPU…) uye DRAM iite yakawanda yekuchinjana data.Izvi zvinowanzo tungamira kune inenge hafu yekushanda uye kushandiswa kwesimba kwehurongwa hwese kutambiswa pakudyidzana kweruzivo.Iye zvino zvatinokwanisa kuderedza kurasikirwa uku kusvika pasi pe20% nekubatanidza processor neDRAM pedyo pamwe chete sezvinobvira kuburikidza neakasiyana 2.5D/3D mapakeji, tinogona kuderedza zvakanyanya mutengo wekombuta.Uku kuwedzera kwekubudirira kunodarika kufambira mberi kwakaitwa kuburikidza nekugamuchirwa kwemaitiro epamusoro ekugadzira
Zhejiang NeoDen Technology Co., LTD., yakavambwa muna 2010 iine vashandi zana & 8000+ Sq.m.fekitori yekodzero yezvivakwa yakazvimirira, kuve nechokwadi chekutonga kwakajairwa uye kuwana zvakanyanya hupfumi mhedzisiro pamwe nekuchengetedza mutengo.
Inove neyako machining centre, ane hunyanzvi anosanganisa, tester uye QC mainjiniya, kuve nechokwadi kugona kwakasimba kweNeoDen michina yekugadzira, mhando uye kuendesa.
Ane hunyanzvi uye nyanzvi yerutsigiro rwechirungu & masevhisi mainjiniya, kuve nechokwadi chemhinduro yekukurumidza mukati memaawa masere, mhinduro inopa mukati memaawa makumi maviri nemana.
Iyo yakasarudzika pakati pevagadziri vese veChinese vakanyoresa uye vakabvumidza CE neTUV NORD.
Nguva yekutumira: Sep-22-2023