Chii Chatinofanira Kufunga Pakusarudza Solder, PCB uye Packaging Zvishandiso?

Mumusangano wePCBA, kusarudzwa kwezvinhu kwakakosha pakuita kwebhodhi uye kuvimbika.Heano mamwe ekufunga nezve solder, PCB uye kurongedza zvinhu kusarudzwa:

Solder kusarudza kufunga

1. Lead Free Solder vs Leaded Solder

Lead-isina solder inokosheswa nekuda kwehushamwari hwayo kwezvakatipoteredza, asi zvakakosha kuziva kuti ine tembiricha yepamusoro solder.Lead solder inoshanda pakudziya kwakadzika, asi kune zvakatipoteredza uye hutano njodzi.2.

2. Melting point

Ita shuwa kuti kunyungudika kweiyo solder yakasarudzwa inokodzera tembiricha inodiwa yegungano uye haizokonzerese kukuvadzwa kwekupisa kusinganzwisisike zvikamu.

3. Fluidity

Ita shuwa kuti solder ine fluidity yakanaka kuti ive nechokwadi chekunyorova kwakakwana uye kubatana kwemasoja majoini.

4. Kudzivisa kupisa

Pamashandisirwo ekushisa kwepamusoro, sarudza solder ine yakanaka yekudzivirira kupisa kuti uve nechokwadi chekugadzikana kwejoint solder.

 

PCB zvinhu zvekusarudza kufunga

1. Substrate zvinhu

Sarudza yakakodzera substrate zvinhu, senge FR-4 (girazi faibha reinforced epoxy resin) kana zvimwe zvakakwirira-frequency zvinhu, zvichienderana nezvinodiwa zvekushandisa uye frequency zvinodiwa.

2. Nhamba yeMatanho

Sarudza nhamba yezvikamu zvinodiwa kuti PCB isangane nezvinodiwa zvechiratidzo chekufambisa, pasi uye ndege dzemagetsi.

3. Hunhu impedance

Nzwisisa hunhu impedance yeyakasarudzwa substrate zvinhu kuti ive nechokwadi chekutendeseka kwechiratidzo uye kuenderana nekusiyanisa peya zvinodiwa.

4. Thermal Conductivity

Pazvikumbiro zvinoda kupisa kupisa, sarudza substrate zvinhu zvine good thermal conductivity kubatsira kubvisa kupisa.

 

Package yekusarudza zvinhu

1. Package type

Sarudza iyo yakakodzera pasuru mhando, senge SMD, BGA, QFN, nezvimwewo, zvichibva pane chikamu chechikamu uye zvinodiwa zvekushandisa.

2. Encapsulation zvinhu

Ita shuwa kuti iyo yakasarudzwa encapsulation material inosangana nemagetsi uye mechanical performance zvinodiwa.Funga zvinhu zvakaita seye tembiricha renji, kupisa kupisa, simba remagetsi, nezvimwe.

3. Package thermal performance

Kune zvikamu zvinoda kupisa kupisa, sarudza pasuru ine mashandiro akanaka ekupisa, kana kufunga kuwedzera singi yekupisa.

4. Package size uye pini spacing

Ita shuwa kuti saizi nepini yepakati pepakeji yakasarudzwa inokodzera PCB marongero uye chikamu chechikamu.

5. Kuchengetedzwa kwezvakatipoteredza uye kuenderera mberi

Funga kusarudza zvinhu zvine hushamwari kwezvakatipoteredza izvo zvinoenderana nemirairo yakakodzera uye zviyero.

Pakusarudza zvinhu izvi, zvakakosha kushanda padhuze nevagadziri vePCBA uye vatengesi kuona kuti kusarudzwa kwezvinhu kunosangana nezvinodiwa zvechishandiso chaicho.Zvakare, kunzwisisa zvakanakira, zvisingabatsiri uye hunhu hwezvinhu zvakasiyana-siyana, pamwe nekukodzera kwavo mashandisirwo akasiyana, chinhu chakakosha pakuita sarudzo ine ruzivo.Tichifunga nezve kuwirirana kweiyo solder, PCB uye yekurongedza zvinhu inovimbisa kuita uye kuvimbika kwePCBA.

ND2+N8+T12

Zhejiang NeoDen Technology Co., LTD., yakavambwa muna 2010, inyanzvi inogadzira nyanzvi muSMT pick and place machine, reflow oven, stencil printing machine, SMT production line nezvimwe Zvigadzirwa zveSMT.Isu tine yedu R & D timu uye fekitori pachedu, tichitora mukana weiyo yedu yakapfuma ine ruzivo R&D, yakanyatso dzidziswa kugadzirwa, yakawana mukurumbira mukuru kubva kune vatengi pasi rese.

Mumakore gumi aya, takazvimiririra takagadzira NeoDen4, NeoDen IN6, NeoDen K1830, NeoDen FP2636 uye zvimwe zvigadzirwa zveSMT, izvo zvakatengeswa zvakanaka pasi rese.Kusvika pari zvino, tatengesa michina inodarika zviuru gumi nekutengesa kunze kwenyika dzinopfuura zana nemakumi matatu pasirese, tichigadzira mukurumbira wakanaka pamusika.Mune yedu Ecosystem yepasi rose, isu tinodyidzana nemumwe wedu wepamoyo kuendesa sevhisi inovhara yekutengesa, yepamusoro hunyanzvi uye inoshanda tekinoroji rutsigiro.


Nguva yekutumira: Sep-22-2023

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