Chii chinonzi HDI Circuit Board?

I. Chii chinonzi HDI board?

HDI bhodhi (High Density Interconnector), kureva, high-density interconnect board, iko kushandiswa kwe micro-mapofu yakavigwa gomba tekinoroji, bhodhi redunhu rine dhizaini yakakura yekugovera mutsara.HDI bhodhi ane rwomukati mutsetse uye okunze mutsetse, uye ipapo kushandiswa kuchera, gomba metallization uye mamwe maitiro, kuitira kuti rimwe nerimwe rukoko rwomukati rwomukati kubatana.

II.musiyano uripo pakati peHDI board uye yakajairika PCB

HDI bhodhi rinowanzo gadzirwa uchishandisa nzira yekuunganidza, iyo yakawanda maseru, iyo yakakwirira yehunyanzvi giredhi rebhodhi.Yakajairika HDI bhodhi ndeye 1 nguva laminated, yakakwira-giredhi HDI ichishandisa kaviri kana kupfuura kaviri tekinoroji yelamination, nepo kushandiswa kwemakomba akaturikidzana, maburi ekuzadza plating, laser yakananga punching uye imwe yepamusoro PCB tekinoroji.Kana kuwanda kwePCB kunowedzera kupfuura bhodhi-masere, mutengo wekugadzira neHDI uchave wakaderera pane yechinyakare yakaoma yekutsikirira-yakakodzera maitiro.

Kuita kwemagetsi uye kurongeka kwemasaini eHDI mabhodhi akakwira kupfuura echinyakare maPCB.Mukuwedzera, mabhodhi eHDI ane kuvandudzwa kuri nani kweRFI, EMI, static discharge, thermal conductivity, etc. High Density Integration (HDI) teknolojia inogona kuita kuti chigadzirwa chekupedzisira chigadziriswe zvishoma, apo ichisangana nepamusoro-soro yekushanda kwemagetsi uye kubudirira.

III.iyo HDI board zvinhu

HDI PCB zvinhu zvinoisa mberi zvimwe zvitsva zvinodiwa, zvinosanganisira kugadzikana kwechimiro, anti-static mobility uye kusanamira.zvinhu zvakajairika zveHDI PCB iRCC (resin-coated copper).kune marudzi matatu eRCC, anoti polyimide metalized film, pure polyimide film, uye cast polyimide film.

Zvakanakira zveRCC zvinosanganisira: kukora kudiki, huremu huremu, kuchinjika uye kupisa, kuenderana hunhu impedance uye yakanakisa dimensional kugadzikana.Mukuita kweHDI multilayer PCB, pachinzvimbo chechinyakare chekubatanidza pepa uye foil yemhangura senge insulating medium uye conductive layer, RCC inogona kudzvinyirirwa neyakajairwa kudzvinyirira maitiro nemachipisi.non-mechanical drilling nzira dzakadai selaser dzinobva dzashandiswa kugadzira micro-through-hole interconnections.

RCC inotyaira kuitika uye kuvandudzwa kwePCB zvigadzirwa kubva kuSMT (Surface Mount Technology) kuenda kuCSP (Chip Level Packaging), kubva pakudhirowa kwemuchina kusvika pakuchera laser, uye inosimudzira kusimudzira nekusimudzira kwePCB microvia, ese anove anotungamira HDI PCB zvinhu. zve RCC.

MuPCB chaiyo mukugadzirwa kwekugadzira, pakusarudzwa kweRCC, kune kazhinji FR-4 yakajairika Tg 140C, FR-4 yakakwirira Tg 170C uye FR-4 uye Rogers musanganiswa laminate, iyo inonyanya kushandiswa mazuva ano.Nekuvandudzwa kweHDI tekinoroji, HDI PCB zvinhu zvinofanirwa kusangana nezvimwe zvinodiwa, saka maitiro makuru eHDI PCB zvinhu anofanira kunge ari.

1. Kuvandudzwa uye kushandiswa kwezvinhu zvinoshanduka zvisingashandisi zvinamatira

2. Dielectric layer gobvu uye kutsauka kudiki

3 .kuvandudzwa kweLPIC

4. Zviduku uye zvidiki dielectric constants

5. Zviduku uye zviduku zvinorasikirwa nedhielectric

6. High solder kugadzikana

7. Kunyatsoenderana neCTE (coefficient of thermal expansion)

IV.kushandiswa kweHDI board kugadzira tekinoroji

Kuoma kwekugadzira HDI PCB idiki kuburikidza nekugadzira, kuburikidza nesimbi uye mitsetse yakanaka.

1. Micro-kuburikidza-gomba kugadzira

Micro-kuburikidza-gomba kugadzira kwave kuri dambudziko rekutanga HDI PCB kugadzira.Pane nzira mbiri dzekuchera.

a.Pakuchera-kuburikidza-gomba, kuchera kwemuchina nguva dzose ndiyo yakanakisa sarudzo yekunyanya kushanda kwayo uye mutengo wakaderera.Nekuvandudzwa kweiyo mechanical machining kugona, kushandiswa kwayo mumicro-kuburikidza-gomba kuri kubuda zvakare.

b.Kune marudzi maviri ekuchera laser: photothermal ablation uye photochemical ablation.Iyo yekutanga inoreva maitiro ekudziisa iyo yekushandisa zvinhu kuinyungudutsa uye kuiburitsa kuburikidza ne-buri-gomba rakaumbwa mushure mekukwirira simba kunyura kwelaser.Iyo yekupedzisira inoreva mhedzisiro yeakakwira-simba mafotoni munharaunda yeUV uye kureba kwelaser inodarika mazana mana nm.

Kune marudzi matatu emalaser masisitimu anoshandiswa kuchinjika uye akaomarara mapaneru, anoti excimer laser, UV laser drilling, uye CO 2 laser.Laser tekinoroji haina kukodzera kuchera chete, asiwo yekucheka nekugadzira.Kunyangwe vamwe vagadziri vanogadzira HDI nelaser, uye kunyangwe michina yekuchera laser inodhura, ivo vanopa chaiyo chaiyo, yakagadzikana maitiro uye yakasimbiswa tekinoroji.Zvakanakira laser tekinoroji inoita kuti ive nzira inonyanya kushandiswa mukugadzira mapofu / kuvigwa kuburikidza-gomba.Nhasi, 99% yeHDI microvia maburi anowanikwa nekuchera laser.

2. Kuburikidza nesimbi

Iyo yakanyanya kuomesesa mu-buri-gomba metallization ndiko kuomerwa mukuwana yunifomu plating.Kune yakadzika gomba plating tekinoroji ye micro-kuburikidza nemakomba, mukuwedzera pakushandisa plating mhinduro ine yakakwira yekuparadzira kugona, mhinduro yekuisa pachigadziro cheplating inofanira kukwidziridzwa nekufamba kwenguva, iyo inogona kuitwa neyakasimba mechanicha inosimudzira kana vibration, ultrasonic kubvongodza, uye. horizontal spraying.Mukuwedzera, hunyoro hwemadziro ekuburikidza neburi hunofanira kuwedzerwa kusati kwaputirwa.

Pamusoro pekuvandudza magadzirirwo, HDI kuburikidza-gomba simbi nzira dzakaona kuvandudzwa mumatekinoroji makuru: makemikari plating yekuwedzera tekinoroji, yakananga plating tekinoroji, nezvimwe.

3. Mutsara Wakanaka

Kuitwa kwemitsara yakanaka kunosanganisira yakajairwa kutamisa mifananidzo uye yakananga laser imaging.Kufambiswa kwemifananidzo kwakajairika ndiyo nzira yakafanana neyakajairika kemikari etching kugadzira mitsetse.

Kune laser yakananga imaging, hapana firimu remifananidzo rinodiwa, uye mufananidzo unoumbwa zvakananga pane photosensitive firimu nelaser.UV wave mwenje inoshandiswa pakushanda, ichigonesa mvura inochengetedza mhinduro kuzadzisa zvinodikanwa zvekugadziriswa kwepamusoro uye kushanda kuri nyore.Hapana firimu remifananidzo rinodiwa kudzivirira zvisingadiwe mhedzisiro nekuda kwekukanganisa kwemafirimu, zvichibvumira kubatana kwakananga kuCAD/CAM uye kupfupisa kutenderera kwekugadzira, zvichiita kuti ive yakakodzera kune mashoma uye akawanda ekugadzira anomhanya.

Zhejiang NeoDen Technology Co., LTD., yakavambwa muna 2010, inyanzvi inogadzira nyanzvi muSMT pick and place machine,reflow oven, stencil kudhinda muchina, SMT mutsara wekugadzira uye zvimweSMT Zvigadzirwa.Isu tine yedu R & D timu uye fekitori pachedu, tichitora mukana weiyo yedu yakapfuma ine ruzivo R&D, yakanyatso dzidziswa kugadzirwa, yakawana mukurumbira mukuru kubva kune vatengi pasi rese.

Mumakore gumi aya, takazvimiririra takagadzira NeoDen4, NeoDen IN6, NeoDen K1830, NeoDen FP2636 uye zvimwe zvigadzirwa zveSMT, izvo zvakatengeswa zvakanaka pasi rese.

Isu tinotenda kuti vanhu vakuru uye vatinoshanda navo vanoita NeoDen kambani hombe uye kuti kuzvipira kwedu kune Innovation, Diversity uye Sustainability inovimbisa kuti SMT otomatiki inowanikwa kune wese hobbyist pese pese.