Pfungwa huru dzechinyorwa chino
- BGA mapakeji akakwana muhukuru uye ane pini yakakura density.
-Mumapakeji eBGA, siginecha crosstalk nekuda kwekumisikidzwa kwebhora uye kusarongeka kunonzi BGA crosstalk.
- BGA crosstalk inoenderana nenzvimbo yechiratidzo chemukati uye chiratidzo chemunhu anenge abatwa mubhora regidhi.
Mune akawanda-gedhi uye pini-kuverenga ICs, nhanho yekubatanidza inowedzera exponentially.Aya machipisi ave akanyanya kuvimbika, akasimba, uye ari nyore kushandisa nekuda kwekuvandudzwa kwebhora grid array (BGA) mapakeji, madiki muhukuru uye ukobvu uye akakurisa muhuwandu hwepini.Nekudaro, BGA crosstalk inokanganisa zvakanyanya kutendeseka kwechiratidzo, nekudaro ichidzikamisa kushandiswa kweBGA mapakeji.Ngatikurukurei BGA kurongedza uye BGA crosstalk.
Bhora Grid Array Packages
A BGA package ndeye pamusoro pegomo pasuru inoshandisa diki simbi conductor mabhora kukwira yakabatanidzwa redunhu.Aya mabhora esimbi anoumba grid kana matrix pattern iyo yakarongedzwa pasi pepamusoro pe chip uye yakabatanidzwa kune yakadhindwa redunhu bhodhi.
A bhora grid array (BGA) package
Midziyo yakarongedzerwa muBGA haina mapini kana madhiri padivi peiyo chip.Pane kudaro, bhora regridhi rakaiswa pazasi pe chip.Aya mabhora egidhi arrays anonzi mabhora ekutengesa uye anoita sezvibatanidza zveBGA package.
Microprocessors, WiFi chips, uye FPGAs vanowanzo shandisa BGA mapakeji.Mune BGA package chip, mabhora ekutengesa anobvumira ikozvino kuyerera pakati pePCB nepasuru.Aya mabhora ekutengesa akabatanidzwa mumuviri kune semiconductor substrate yemagetsi.Lead bonding kana flip-chip inoshandiswa kumisikidza kubatana kwemagetsi kune substrate uye kufa.Conductive alignments inowanikwa mukati me substrate inobvumira masaini emagetsi kuti aendeswe kubva panosangana chip uye substrate kusvika kune junction pakati pe substrate uye bhora regridhi array.
Iyo BGA package inogovera yekubatanidza inotungamira pasi pekufa mune matrix pateni.Urongwa uhwu hunopa huwandu hukuru hweinotungamira muBGA package pane mufurati uye kaviri-mutsara mapakeji.Muchikwata chinotungamirirwa, mapini anorongwa pamiganhu.pini yega yega yeBGA package inotakura solder bhora, iro riri pazasi pechiso chechip.Urongwa uhwu huri pazasi hunopa nzvimbo yakawanda, zvichiita kuti pave nepini dzakawanda, zvishoma kudzivirira, uye shoma shoma shoma.Mupakeji yeBGA, mabhora ekutengesa anoenderana nekureba zvakanyanya kupfuura mupakeji ine zvinotungamira.
Zvakanakira zveBGA mapakeji
Iyo BGA package ine compact dimensions uye yakakwira pini density.iyo BGA package ine yakaderera inductance, ichibvumira kushandiswa kweakaderera voltages.Iyo bhora regridhi rakakamurwa zvakanaka, zvichiita kuti zvive nyore kurongedza BGA chip nePCB.
Mamwe mabhenefiti eiyo BGA package ndeaya:
- Kupisa kwakanaka kwekupisa nekuda kwekushomeka kwekushisa kwepakeji.
- Iyo inotungamira kureba muBGA mapakeji ipfupi pane mumapakeji ane inotungamira.Huwandu hwepamusoro hwekutungamira hwakasanganiswa nehukuru hudiki hunoita kuti BGA package iwedzere kuitisa, nekudaro inovandudza mashandiro.
- BGA mapakeji anopa kushanda kwepamusoro pakumhanya kwakanyanya kana zvichienzaniswa neflat mapakeji uye maviri mumutsara mapakeji.
- Iko kumhanya uye goho rekugadzira PCB rinowedzera kana uchishandisa BGA-yakarongedza zvishandiso.Iyo solder process inova nyore uye nyore, uye BGA mapakeji anogona kugadzirwa zvakare nyore.
BGA Crosstalk
BGA mapakeji ane zvimwe zvipingamupinyi: solder mabhora haagone kupetwa, kuongorora kwakaoma nekuda kwekuwanda kwepakeji, uye kugadzirwa kwevhoriyamu yakakura kunoda kushandiswa kwemidziyo inodhura yekushongedza.
Kuderedza BGA crosstalk, yakaderera-crosstalk BGA gadziriro yakakosha.
BGA mapakeji anowanzo shandiswa muhuwandu hukuru hweI / O zvishandiso.Zviratidzo zvinofambiswa uye zvinogamuchirwa neyakasanganiswa chip muBGA package inogona kuvhiringidzwa nechiratidzo chesimba rekubatanidza kubva kune imwe lead kuenda kune imwe.Signal crosstalk inokonzerwa nekurongeka uye kusarongeka kwemabhora anotengeswa muBGA package inonzi BGA crosstalk.Iyo inopera inductance pakati pebhora gidhi arrays ndechimwe chezvikonzero zvecrosstalk mhedzisiro mumapakeji eBGA.Kana yakakwira I / O ikozvino inotenderera (yekupinda masaini) inoitika muBGA pasuru inotungamira, iyo inogumira inductance pakati pebhora regidhi arrays inoenderana nechiratidzo uye mapini ekudzoka anogadzira kukanganiswa kwevoltage pane chip substrate.Kukanganiswa kwemagetsi uku kunokonzeresa chiratidzo glitch chinofambiswa kunze kweBGA package seruzha, zvichikonzera crosstalk mhedzisiro.
Mumaapplications akadai setiweki masisitimu ane gobvu PCB anoshandisa kuburikidza-maburi, BGA crosstalk inogona kujairika kana pasina matanho anotorwa kudzivirira maburi-maburi.Mumaseketi akadai, kureba kuburikidza nemakomba akaiswa pasi peBGA anogona kukonzera kwakakosha kubatanidza uye kuburitsa inooneka crosstalk kukanganisa.
BGA crosstalk inoenderana nenzvimbo yechiratidzo chemukati uye chiratidzo chemunhu anenge abatwa mubhora regidhi.Kudzikisa BGA crosstalk, yakaderera-crosstalk BGA pasuru kurongeka kwakakosha.NeCadence Allegro Package Designer Plus software, vagadziri vanogona kukwidziridza yakaoma single-die uye multi-die wirebond uye flip-chip magadzirirwo;radial, full-angle push-squeeze routing kugadzirisa zvakasarudzika zvipingamupinyi zveBGA/LGA substrate dhizaini.uye yakananga DRC/DFA inotarisa kuti yakanyatsojeka uye inoshanda nzira.Chaiyo DRC/DFM/DFA cheki inova nechokwadi chakabudirira magadzirirwo eBGA/LGA mune imwechete pass.yakadzama yekubatanidza kudhirowa, 3D pasuru yekuenzanisira, uye chiratidzo chekuvimbika uye ongororo yekupisa ine simba rekupa simba inopihwa zvakare.
Nguva yekutumira: Mar-28-2023