SMT ndechimwe chezvinhu zvakakosha zvezvikamu zvemagetsi, zvinodaidzwa kuti nzira dzekusangana dzekunze, dzakakamurwa kuita pasina pini kana nhanho pfupi, iri kuburikidza nekuita reflow soldering kana dip soldering kune welding musangano wemaitiro egungano redunhu, zvakare ndiyo inonyanya kufarirwa electronic assembly industry a technique.Kuburikidza nemaitiro eSMT tekinoroji yekuisa zvimwe zvidiki uye zvakareruka zvikamu, kuitira kuti redunhu bhodhi ripedze yakakwira perimeter, miniaturization zvinodiwa, zviri zvakare pane SMT kugadzirisa hunyanzvi kukumbira kumusoro.
I. SMT processing solder paste zvakakodzera kuteerera
1. Constant tembiricha: kutanga mufiriji yekuchengetedza tembiricha ye5 ℃ -10 ℃, ndapota usaende pazasi 0 ℃.
2. Kunze kwekuchengetera: inofanira kuenderana nemirairo yechizvarwa chekutanga kutanga kunze, usaite solder paste mufiriji yekuchengetedza nguva yakarebesa.
3. Kuomesa nechando: Isai solder paste zvakasununguka kweinenge maawa mana mushure mekuibvisa mufiriji, usavhare chivharo kana uchitonhora.
4. Mamiriro ezvinhu: Tembiricha yewekishopu i25±2℃ uye hunyoro huri 45%-65%RH.
5. Yakashandiswa yekare solder paste: Mushure mekuvhura chivharo che solder paste yekutanga mukati memaawa gumi nemaviri kuti ushandise kumusoro, kana uchida kuchengetedza, ndapota shandisa bhodhoro rakachena risina chinhu kuti uzadze, uye wozovharirwa zvakare mufiriji kuti uchengetedze.
6. pahuwandu hwenamira pane stencil: nguva yekutanga pahuwandu hwe solder paste pane stencil, kuitira kudhinda kutenderera usayambuka scraper urefu hwe 1/2 sezvakanaka, ita kushingaira kuongorora, kushingaira kuwedzera kwe nguva yekuwedzera mari shoma.
II.SMT chip kugadzirisa basa rekudhinda rinodiwa kuti uteerere
1. scraper: scraper zvinhu zvakanakisisa kutora simbi yesimbi, inobatsira kudhinda paPAD solder paste molding uye kubvisa firimu.
Scraper angle: manual printing ye 45-60 degrees;mechanical kudhinda kwe60 degrees.
Kudhinda kumhanya: bhuku 30-45mm/min;michina 40mm-80mm/min.
Kudhinda mamiriro: tembiricha pa23 ± 3 ℃, hunyoro hunoenderana 45% -65% RH.
2. Stencil: Kuvhura kwestencil kunobva pahupamhi hweiyo stencil uye chimiro uye chikamu chekuvhura zvinoenderana nekukumbira kwechigadzirwa.
3. QFP / CHIP: nzvimbo yepakati iri pasi pe 0.5mm uye 0402 CHIP inoda kuvhurwa ne laser.
Test stencil: kumisa stencil tension test kamwechete pavhiki, kukosha kwekunetseka kunokumbirwa kuti ive pamusoro pe35N / cm.
Kuchenesa stencil: Paunenge uchidhinda 5-10 PCBs nguva dzose, pukuta stencil kamwe neguruva-isina kupukuta bepa.Hapana mamvemve anofanira kushandiswa.
4. Mushandi wekuchenesa: IPA
Solvent: Nzira yakanakisa yekuchenesa stencil ndeye kushandisa IPA uye doro zvinonyungudutsa, usashandise zvinonyungudutsa zvine chlorine, nekuti zvinokuvadza kuumbwa kweiyo solder paste uye kukanganisa kunaka.
Nguva yekutumira: Jul-05-2023