Ndezvipi zvakanakira theBGA rework station?Ngatitarisei.
1. Simba uye rakakwana basa kusarudzwa, ndangariro mhando sere tembiricha curves, vashandisi vanogona kusarudza chero kudziyisa curve maererano nezvinodiwa desoldering.
2. Intelligent curve kudziyisa, unogona otomatiki kupedza yose desoldering muitiro maererano preset tembiricha yako curve, zvichiita yose desoldering muitiro zvesayenzi.
3. Kugadziriswa kwetatu-dimensional yemuviri wemwenje, inodzoreredza slide furemu system, inokodzera chero ma angle components desoldering, infrared rambi body ine laser positioning, kuitira kuti gadziriso yacho iwedzere nyore kumira zvakanyanya.
4. PID yakangwara yekudzora tembiricha tekinoroji, tembiricha yekudzora tembiricha yakanyatsojeka, iyo curve yakanyanya kukwana, inogona kunyatso kudzivirira kukurumidza kukwira kwekushisa kana kusingapindike kukwira kwekushisa uye kukonzera kukanganisa kune chip kana redunhu board.
5.Ultra-high power preheating melt glue system, uye kushandiswa kwezvigadziriswe zvakagadzirirwa infrared heat devices, kupinza kwakasimba, chigadziro chekupisa kufanana, kutonga kwakarurama kwekushisa.Inogona kuparadza kana kugadzirisazve BGA, SMD, CSP, LGA, QFP, PLCC uye BGA kudyara bhora, mitsara yakasiyana-siyana yemapuragi mitsetse nemapini sockets (seCPU socket uye GAP plug row), inokwanisa zvizere kusangana nekombuta, notebook, e- mitambo uye zvimwe BGA desoldering / rework zvinodiwa, kunyanya akakodzera kombiyuta kuchamhembe uye kumaodzanyemba zambuko desoldering.
6.Friendly man-machine interface, yakakwana LCD kuratidza, iyo yose inopisa nzira kuti iwe unzwisise pane imwe nguva.
7.Rigid kuonekwa, lightweight volume, kubva pakutanga kusvika pakupedzisira kuratidza tekinoroji-based, table-top placement mode, kuitira kuti uwane nzvimbo yakawanda, mirairo yekushanda iri nyore, saka unogona kuiverenga.
Tsanangudzo yeBGA Rework Station
Kugovera Simba: AC220V±10% 50/60HZ
Simba: 5.65KW(Max), Yepamusoro hita (1.45KW)
Pazasi hita (1.2KW), IR Preheater (2.7KW), Zvimwe (0.3KW)
PCB Size: 412*370mm(Max); 6*6mm(Min)
BGA Chip Size: 60 * 60mm (Max); 2 * 2mm (Min)
IR Heater Size: 285 * 375mm
Kupisa Sensor: 1 pcs
Maitiro Okushandisa: 7 ″ HD kubata sikirini
Kudzora Sistimu: Autonomous yekudziya yekudzora system V2 (software copyright)
Ratidza Sistimu: 15 ″ SD indasitiri kuratidza (720P yekumberi skrini)
Alignment System: 2 Mamirioni Pixel SD dijitari yekufungidzira system, otomatiki optical zoom ine laser: red-dot chiratidzo
Vacuum Adsorption: otomatiki
Kurongeka Kwechokwadi: ± 0.02mm
Kudzora Kudzora: K-mhando thermocouple yakavharwa-loop control nekurongeka kusvika ± 3 ℃
Kudyisa Chishandiso: Kwete
Positioning: V-groove ine universal fixture
Zviyero: L685 * W633 * H850mm
Kurema: 76KG
Nguva yekutumira: Mar-24-2023