Ndezvipi Zvakanakira uye Zvakaipa zveBGA Packaged?

I. BGA yakaputirwa ndiyo nzira yekurongedza ine yepamusoro-soro zvinodiwa muPCB kugadzira.Zvayakanakira ndezvizvi:
1. Pini pfupi, kureba kwegungano, diki parasitic inductance uye capacitance, kuita kwakanakisa kwemagetsi.
2. Yakanyanya kubatanidzwa, mapini akawanda, hombe yepini spacing, yakanaka pini coplanar.Muganho wepini spacing yeQFP electrode ndeye 0.3mm.Pakuunganidza iyo welded circuit board, iko kukwira kweiyo QFP chip kwakasimba kwazvo.Kuvimbika kwekubatana kwemagetsi kunoda kukwirisa kushivirira kuve 0.08mm.Mapini emagetsi eQFP ane nzvimbo yakamanikana akatetepa uye asina kusimba, ari nyore kumonyorora kana kutyoka, izvo zvinoda kuti parallelism uye planarity pakati redunhu bhodhi mapini anofanira kuvimbiswa.Kusiyana neizvi, mukana mukuru weBGA package ndeyekuti iyo 10-electrode pin spacing yakakura, yakajairika spacing i1.0mm.1.27mm, 1.5mm (Inch 40mil, 50mil, 60mil), iyo inokwirisa kushivirira i0.3mm, ine yakajairika yakawanda. -kushandaSMT muchinauyereflow oveninogona kuzadzisa zvinodiwa zveBGA musangano.

II.Nepo BGA encapsulation ine zvakanakira zviri pamusoro, ine zvakare anotevera matambudziko.Izvi zvinotevera zvakaipira BGA encapsulation:
1. Zvakaoma kuongorora uye kuchengetedza BGA mushure mekuputika.Vagadziri vePCB vanofanirwa kushandisa X-ray fluoroscopy kana X-ray layering yekuongorora kuti vaone kuvimbika kweiyo redunhu bhodhi welding yekubatanidza, uye mutengo wemidziyo wakakwira.
2. Majoini ega ega ega ega ebhodhi akaputsika, saka chikamu chose chinofanira kubviswa, uye BGA yakabviswa haigoni kushandiswa zvakare.