I. Tsanangudzo yemashure
Wave soldering muchinawelding iri kuburikidza neyakanyungudutswa solder pachikamu mapini ekushandisa solder uye kudziyisa, nekuda kwehukama hwekufamba kwemafungu uye PCB uye yakanyungudutswa solder "inonamira", wave soldering process yakanyanya kuoma kupfuura reflow soldering, kutengeswa pasuru. pini spacing, pini kunze kureba, pad size inodiwa, paPCB Kurongeka kwebhodhi kutungamira, nzvimbo, pamwe nekuiswa kwegomba mutsara kune zvinodiwa, muchidimbu, wave soldering process haina kunaka, inoda, welding. zvibereko zvinonyanya kuenderana nekugadzirwa.
II.Packaging zvinodiwa
1. yakakodzera wave soldering placement element inofanira kunge ine solder end kana lead end yakafumurwa;Package body kubva pasi pemvumo (Sima Off) <0.15mm;Hurefu <4mm zvakakosha zvinodiwa.Sangana neaya mamiriro ezvikamu zvekuisa anosanganisira:
0603 ~ 1206 pasuru saizi yemhando ye chip resistive zvikamu.
SOP ine lead centre chinhambwe ≥1.0mm uye kureba <4mm.
Chip inductors ane hurefu ≤ 4mm.
Asina-kufumurwa coil chip inductors (kureva C, M mhando)
2. inokodzera wave soldering ye dense foot cartridge components for the minibure distance between adyo pini ≥ 1.75mm package.
III.Nzira yekufambisa
Pamberi peiyo wave soldering pamusoro pechikamu dhizaini, yekutanga inofanirwa kuona iyo PCB pamusoro pechoto chekufambisa nzira, ndiko kurongeka kweiyo cartridge zvikamu "process benchmark".Naizvozvo, pamberi peiyo wave soldering pamusoro pezvikamu zvekugadzirisa, yekutanga inofanirwa kuona mafambiro ekutapurirana.
1. Kazhinji, rutivi rurefu runofanira kuva hutungamiri hwekutumira.
2. Kana iyo marongerwo iine yepedyo tsoka katuriji yekubatanidza (pitch <2.54mm), iyo dhizaini dhizaini yekubatanidza inofanira kunge iri kutungamira kwekutumira.
3. mufungu soldering pamusoro, inofanira kuva sirika-yakavharidzirwa kana foil yemhangura yakatemerwa museve unotara kwainotapurirana, kuitira kuziva kana welding.
IV.Rongedzo nzira
Iyo dhizaini dhizaini yezvikamu zvinonyanya zvinosanganisira chip zvikamu uye akawanda-pini zvinongedzo.
1. iyo yakareba nhungamiro yeSOP mudziyo pasuru inofanira kuenzana newave soldering transmission direction marongero, kureba kwechikamu chechip components, kunofanirwa kunge kuri perpendicular kune wave soldering transmission direction.
2. akawanda maviri-pini katuriji zvikamu, iyo jack centre mutsara kutungamira kunofanirwa kuve perpendicular kune iyo nzira yekutapurirana, kuitira kuderedza chiitiko cheimwe mugumo wechikamu chinoyangarara.
V. Spacing zvinodiwa
Kune zvikamu zveSMD, iyo pad spacing inoreva kupindirana pakati pehukuru hwekusvika maitiro emapakeji ari padyo (kusanganisira mapadhi);kune zvikamu zvekaturiji, iyo pad spacing inoreva kupindirana pakati pemapedhi ekutengesa.
Kune zvikamu zveSMD, iyo pad spacing haisi zvachose kubva kune bhiriji rekubatanidza zvinhu, kusanganisira kuvharika kwemuviri wepakeji kunogona kukonzera kuvuza kwe solder.
1. cartridge components pad interval inofanira kazhinji kuva ≥ 1.00mm.kune yakanaka pitch cartridge yekubatanidza, bvumira kuderedzwa kwakakodzera, asi iyo shoma haifanirwe kuve <0.60mm.
2. cartridge component pads uye wave soldering SMD component pads inofanira kuva ≥ 1.25mm interval.
VI.Pad dhizaini yakakosha zvinodiwa
1. kuitira kuderedza leakage soldering, ye0805/0603, SOT, SOP, tantalum capacitor pads, zvinokurudzirwa kuti dhizaini inoenderana nezvinodiwa zvinotevera.
Kune 0805/0603 zvikamu, maererano ne IPC-7351 yakakurudzirwa dhizaini (pad flare 0.2mm, hupamhi hwakaderedzwa ne30%).
Kune SOT uye tantalum capacitors, mapedhi anofanirwa kuwedzerwa kunze ne 0.3mm zvichienzaniswa neanowanzo gadzirwa mapedhi.
2. yesimbi yegomba ndiro, simba rejoint solder rinonyanya kuvimba nekubatana kwegomba, pedhi mhete yehupamhi ≥ 0.25mm inogona kuva.
3. Kune isina-metallized gomba ndiro (pani imwe chete), simba rejojo rekutengesa rinotarirwa nehukuru hwepadhi, iyo yakawanda pad dhayamita inofanira kuva ≥ 2.5 nguva dhayamita yegomba.
4. yeSOP package, inofanira kugadzirwa pamagumo epini inoba mapedhi, kana SOP pitch yakakura, kuba tin pad design inogonawo kuva yakakura.
5. ye-multi-pin connectors, inofanira kugadzirwa mu-off-tin kupera kwematani akabiwa.
VII.Kutungamira kunze kureba
1. kureba kwekubuda kwekuumbwa kwebhiriji kune hukama hukuru, idiki yepini spacing, iyo yakakura kukonzeresa kwekurudziro:
Kana pini yepini iri pakati pe2 ~ 2.54mm, iyo inotungamira kureba inofanira kudzorwa pa 0.8 ~ 1.3mm.
Kana pini yepini <2mm, iyo inotungamira yekuwedzera kureba inofanira kudzorwa pa 0.5 ~ 1.0mm
2. kutungamirira kunze kureba chete muchikamu marongerwo nzira kuzadzisa zvinodiwa wave soldering mamiriro anogona kuita basa, zvikasadaro kubviswa mugumisiro zambuko kubatana hakusi pachena.
VIII.kushandisa solder kuramba ingi
1. Isu tinowanzo kuona imwe yekubatanidza pad graphics chinzvimbo chakadhindwa neingi magirafu, dhizaini yakadaro inowanzo tariswa kuderedza chiitiko chebhiriji.Iyo meshini inogona kunge iri inki layer pamusoro iine hutsinye, iri nyore kushambadza yakawanda flux, flux yakasangana nepamusoro tembiricha yakanyungudutswa solder volatilization uye kuumbwa kwekuzviparadzanisa nevamwe, nekudaro kuderedza kuitika kwebhiriji.
2. Kana chinhambwe chiri pakati pemapedhi epini <1.0mm, unogona kugadzira solder kuramba inki layer kunze kwemapadhi kuti kuderedze mukana wekutamburwa, izvo zvinonyanya kubvisa dense pads pakati pepakati pejoint bridging, uye kuba kwerata. Mapadhi anonyanya kubvisa dense padhi boka rekupedzisira desoldering kuguma solder joint bhiridha mabasa avo akasiyana.Naizvozvo, yepini spacing idiki diki dense mapedhi, solder kuramba inki uye kuba kwepadhi solder kunofanirwa kushandiswa pamwechete.
Nguva yekutumira: Zvita-14-2021