Iyo nzira yekugadzira yemabhodhi akawanda inowanzoitwa neyemukati dhizaini giraidhi kutanga, zvino nekudhinda uye etching nzira yekugadzira imwe-side kana kaviri-mativi substrate, uye mune yakasarudzika layer pakati, uyezve nekupisa, kudzvanya uye kubatana, sekuchera kunotevera kwakafanana nekaviri-sided plating kuburikidza-gomba nzira.
1. Chekutanga, iyo FR4 yedunhu bhodhi inofanira kugadzirwa kutanga.Mushure mekuputira mhangura ine perforated mu substrate, maburi anozadzwa neresin uye mitsetse yekumusoro inoumbwa ne subtractive etching.Iyi nhanho yakafanana neyakajairwa FR4 bhodhi kunze kwekuzadzwa kwemaperforations neresin.
2. Iyo photopolymer epoxy resin inoshandiswa seyokutanga yekuvhara FV1, uye mushure mekuomeswa, iyo photomask inoshandiswa kune danho rekutsvaga, uye mushure mekuratidzwa, solvent inoshandiswa kugadzira gomba rezasi regomba rembambo.Kuomesa resin kunoitwa mushure mekuvhurwa kwegomba.
3. Iyo epoxy resin pamusoro inoomeswa nepermanganic acid etching, uye mushure mekucheka, dhizaini yemhangura inoumbwa pamusoro neelectroless copper plating yeinotevera nhanho yekuisa mhangura.Mushure mekuputira, iyo yemhangura conductor layer inoumbwa uye base layer inoumbwa ne subtractive etching.
4. Yakaputirwa nechikamu chechipiri chekudzivirira, uchishandisa matanho akafanana ekukura kwekutsvaga kugadzira gomba rebhaudhi pasi pegomba.
5. Kana kudiwa perforation, unogona kushandisa kuchera makomba kuumba perforations pashure paumbwe mhangura electroplating etching kuumba waya.
muchikamu chekunze chebhodhi redunhu rakaputirwa nependi ye-anti-tin, uye kushandiswa kwenzira yekuvandudza yekuratidzira kuratidza chikamu chekusangana.
6. Kana nhamba yezvikamu zvikawedzera, ingodzokorora matanho ari pamusoro apa.Kana paine mamwe matinji pamativi ese ari maviri, iyo insulation layer inofanirwa kuve yakaputirwa pamativi ese echigadziko layer, asi iyo plating process inogona kuitwa pamativi ese panguva imwe chete.
Nguva yekutumira: Nov-09-2022