Mamwe matambudziko akajairika uye mhinduro mune soldering

Kupupa paPCB substrate mushure meSMA solder

Chikonzero chikuru chekuonekwa kwehukuru hwembambo mablister mushure meSMA welding zvakare hunyoro hwakaiswa muPCB substrate, kunyanya mukugadzirisa mabhodhi akawanda.Nekuti iyo multilayer board inogadzirwa ne-multi-layer epoxy resin prepreg uye yobva yapisa yakadzvanywa, kana nguva yekuchengetera epoxy resin semi curing chidimbu ipfupi, iyo resin yemukati haina kukwana, uye kubviswa kwemwando nekutanga kuomesa hakuna kuchena, zviri nyore kutakura mhute yemvura mushure mekupisa kupisa.Zvakare nekuda kweiyo semi-yakasimba pachayo glue zvinyorwa hazvina kukwana, kunamatira pakati pematanho hakuna kukwana uye kusiya mabhuru.Uye zvakare, mushure mekunge PCB yatengwa, nekuda kwenguva yakareba yekuchengetedza uye hunyoro yekuchengetedza nharaunda, iyo chip haina kubikwa kare munguva isati yagadzirwa, uye iyo yakanyoroveswa PCB inowanzoita blister.

Solution: PCB inogona kuiswa mudura mushure mekugamuchirwa;PCB inofanira kubikwa kare pa (120 ± 5) ℃ kwemaawa mana isati yaiswa.

Vhura dunhu kana manyepo soldering yeIC pini mushure mekutengesa

Zvinokonzera:

1) Kusakwana coplanarity, kunyanya kune fqfp zvishandiso, zvinotungamira kune pini deformation nekuda kwekuchengetedza kusina kunaka.Kana iyo mounter isina basa rekutarisa coplanarity, hazvisi nyore kuziva.

2) Kusaita solderability yepini, nguva refu yekuchengetedza yeIC, yellowing yepini uye kushata solderability ndizvo zvinonyanya kukonzera soldering yenhema.

3) Solder paste ine hurombo husina kunaka, yakaderera simbi yemukati uye yakashata solderability.Iyo solder paste inowanzo shandiswa welding fqfp midziyo inofanira kuva nesimbi yemukati isingasviki 90%.

4) Kana tembiricha yekupisa yakakwira zvakanyanya, zviri nyore kukonzera oxidation yeIC pini uye kuita kuti solderability iwedzere.

5) Ukuru hwekudhinda template hwindo idiki, kuitira kuti chiyero che solder paste hachina kukwana.

mitemo yekugadzirisa:

6) Nyatsoteerera kuchengetwa kwechigadzirwa, usatora chikamu kana kuvhura pasuru.

7) Panguva yekugadzirwa, kutengesa kwezvikamu kunofanira kuongororwa, kunyanya nguva yekuchengetedza IC haifaniri kunge yakareba (mukati megore rimwe kubva pazuva rekugadzirwa), uye IC haifaniri kuratidzirwa kune kupisa kwakanyanya uye kunyoro panguva yekuchengetedza.

8) Nyatsotarisa ukuru hwehwindo retemplate, iro risingafanire kunge rakakura kana diki, uye teerera kuti uenderane nePCB pad size.