1. Background
Wave soldering inoshandiswa uye inopisa neyakanyungudutswa solder kumapini ezvikamu.Nekuda kwekufamba kunoenderana kwewave crest uye PCB uye "kunamira" kweyakanyungudutswa solder, wave solder maitiro akaomarara pane reflow welding.Pane zvinodikanwa zvepini spacing, pini yekuwedzera kureba uye padhi saizi yepakeji inofanira kuiswa weld.Kune zvakare zvinodikanwa kune iyo dhizaini dhizaini, nzvimbo uye kubatana kwemakomba anokwira paPCB board surface.Mune izwi, maitiro ekuisa wave soldering akashata uye anoda mhando yepamusoro.Kukohwa kwewelding kunoenderana nekugadzira.
2. Packaging zvinodiwa
a.Mount components anokodzera wave soldering anofanirwa kunge aine welding ends kana anotungamira anobuda pachena;Package body ground clearance (Mira Kure) <0.15mm;Hurefu <4mm zvakakosha zvinodiwa.
Mount zvinhu zvinosangana nemamiriro aya zvinosanganisira:
0603 ~ 1206 chip kuramba uye capacitance zvinhu mukati mepakeji saizi renji;
SOP ine lead centre chinhambwe ≥1.0mm uye kureba <4mm;
Chip inductor nehurefu ≤4mm;
Isina-yakafumurwa coil chip inductor (rudzi C, M)
b.Iyo compact pini inokodzera chinhu chakakodzera wave soldering ndiyo pasuru ine diki chinhambwe pakati pepedyo pini ≥1.75mm.
[Mashoko]Iko kudiki kupatsanurwa kwezvikamu zvakaiswa inzvimbo inogamuchirwa yewave soldering.Nekudaro, kusangana nedikidiki spacing inodiwa hazvirevi kuti welding yemhando yepamusoro inogona kuwanikwa.Zvimwe zvinodikanwa senge dhizaini dhizaini, kureba kwemutobvu kunze kwewelding surface, uye pad spacing zvinofanirwa kusangana.
Chip mount element, pasuru saizi <0603 haina kukodzera wave soldering, nekuti gap riri pakati pemigumo miviri yechinhu idiki, nyore kuti riitike pakati pemigumo miviri yebhiriji.
Chip mount element, pasuru saizi> 1206 haina kukodzera kutenderera kwemafungu, nekuti wave soldering haina kuenzana kupisa, hombe saizi chip resistance uye capacitance element iri nyore kutsemuka nekuda kwekupisa kwekuwedzera kusawirirana.
3. Nzira yekufambisa
Pamberi pekurongeka kwezvikamu pane wave soldering surface, nzira yekufambisa yePCB kuburikidza nechoto inofanira kutanga yatangwa, inova "process reference" yekurongwa kwezvikamu zvakaiswa.Naizvozvo, kutungamira kwekutapurirana kunofanirwa kutariswa pamberi pekurongeka kwezvikamu pane wave soldering surface.
a.Kazhinji, nzira yekufambisa inofanira kunge iri kureba.
b.Kana iyo marongerwo iine dense pin isa chokubatanidza (spacing <2.54mm), iyo dhizaini dhizaini yekubatanidza inofanira kunge iri nzira yekufambisa.
c.Pane wave solder pamusoro, sirika sikirini kana yemhangura foil etched museve inoshandiswa kumaka nzira yekutapurirana yekuzivikanwa panguva yewelding.
[Mashoko]Component marongero akakosha zvakanyanya kune wave soldering, nekuti wave soldering ine tin mukati uye tin kunze maitiro.Naizvozvo, dhizaini uye welding inofanira kunge iri munzira imwechete.
Ichi ndicho chikonzero chekumaka kutungamira kwe wave soldering transmission.
Kana iwe ukakwanisa kuona kwainobva kutapurirana, senge dhizaini yetini yakabiwa, kutungamira kwekutapurirana hakugone kuzivikanwa.
4. The marongerwo nzira
Iyo dhizaini dhizaini yezvikamu zvinonyanya zvinosanganisira chip zvikamu uye akawanda-pini zvinongedzo.
a.Iyo yakareba kutungamira kweiyo PACKAGE yeSOP zvishandiso inofanirwa kurongeka inoenderana neiyo nzira yekufambisa yewave peak welding, uye iyo yakareba kutungamira yechip components inofanira kunge iri perpendicular kune yekufambisa nzira yewave peak welding.
b.Kune akawanda-mapini maviri-pini plug-muzvikamu, iyo yekubatanidza nzira yejack centre inofanirwa kunge iri perpendicular kune nzira yekufambisa kudzikisa chinoyangarara chiitiko cheimwe mugumo wechikamu.
[Mashoko]Nekuti iyo pasuru yemuviri wepatch element ine inovharira mhedzisiro pane yakanyungudutswa solder, zviri nyore kutungamira kune leakage welding yemapini kuseri kwepakeji body (destin side).
Naizvozvo, zvinodikanwa zvakajairika zvemuviri wekurongedza hazvikanganise kutungamira kwekuyerera kweyakanyungudutswa solder marongero.
Kusungirirwa kweakawanda-pini majoini kunoitika zvakanyanya kumucheto we-de-tinning / parutivi rwepini.Kurongeka kwemapini ekubatanidza munzira yekutapurirana kunoderedza huwandu hwemapini ekudonhedza uye, pakupedzisira, huwandu hweBridges.Uye wobva wabvisa bhiriji zvachose kuburikidza nedhizaini yerata yakabiwa.
5. Spacing zvinodiwa
Kune zvigamba, pad spacing inoreva kupatsanurana pakati peakanyanya overhang maficha (kusanganisira mapadhi) emapakeji ari padyo;Kune zvikamu zveplug-in, pad spacing inoreva kupatsanurana pakati pemapadhi.
Kune zvikamu zveSMT, pad spacing haingotariswe kubva pabhiriji chikamu, asi zvakare inosanganisira kuvharika kwemuviri wepakeji iyo inogona kukonzera welding kuvuza.
a.Pad spacing yemidziyo yeplug-in inofanira kunge iri ≥1.00mm.Kune yakanaka-pitch plug-in majoini, kudzikisira zvine mwero kunobvumidzwa, asi iyo shoma haifanirwe kuve isingasviki 0.60mm.
b.Nguva iri pakati pepadhi yezvishandiso zveplug-in uye padhi yewave soldering patch components inofanira kuva ≥1.25mm.
6. Zvinodiwa zvakakosha padhizaini yekugadzira
a.Kuti uderedze welding leakage, zvinokurudzirwa kugadzira mapedhi e0805/0603, SOT, SOP uye tantalum capacitors maererano nezvinodiwa zvinotevera.
Kune 0805/0603 zvikamu, tevera dhizaini yakakurudzirwa yeIPC-7351 (padhi yakawedzerwa ne0.2mm uye hupamhi hwakaderedzwa ne30%).
Kune SOT uye tantalum capacitor, mapedhi anofanirwa kukwidziridzwa 0.3mm kunze pane ayo ezvakajairwa dhizaini.
b.yesimbi ine simbi yegomba ndiro, kusimba kweiyo solder kusimba kunoenderana nekubatanidzwa kwegomba, hupamhi hwepadhi mhete ≥0.25mm.
c.Kune maburi asina simbi (pani imwe chete), kusimba kweiyo solder kunoenderana nehukuru hwepadhi, kazhinji dhayamita repadhi rinofanira kunge rinopfuura 2.5 times the aperture.
d.YeSOP yekurongedza, marata ekubira pad anofanirwa kugadzirwa kumagumo kwepini.Kana iyo SOP spacing yakakura, marata ekubira pad dhizaini anogona zvakare kukura.
e.ye-multi-pini yekubatanidza, inofanira kugadzirwa pamagumo emarata epadhi.
7. kutungamirira kureba
a.Hurefu hwekutungamira hune hukama hukuru nekuumbwa kwekubatanidza kwebhiriji, kudiki kwepini spacing, kunowedzera simba.
Kana nzvimbo yepini iri 2 ~ 2.54mm, kureba kwekutungamira kunofanirwa kudzorwa mu 0.8 ~ 1.3mm
Kana nzvimbo yepini iri pasi pe2mm, kureba kwemutobvu kunofanirwa kudzorwa mu 0.5 ~ 1.0mm.
b.Kuwedzera kureba kwekutungamira kunogona chete kuita basa pasi pemamiriro ekuti chikamu chekumisikidza nzira inosangana nezvinodiwa zvewave soldering, zvikasadaro mhedzisiro yekubvisa bhiriji haisi pachena.
[Mashoko]Kurudziro yehurefu hwe lead pakubatanidza bhiriji yakanyanya kuomarara, kazhinji > 2.5mm kana <1.0mm, pesvedzero yekubatanidza bhiriji idiki, asi pakati pe1.0-2.5m, kufurira kwakakura.Ndiko kuti, inowanzokonzera bridging phenomenon kana isiri kureba kana kupfupika.
8. Kushandiswa kweinki yewelding
a.Isu tinowanzo kuona imwe yekubatanidza pad magiraidhi akadhindwa inki magirafu, dhizaini yakadai inowanzotendwa kuderedza chiitiko chebhiriji.Iyo meshini inogona kunge iri iyo pamusoro peiyo ingi layer yakakasharara, nyore kutora yakawanda flux, inoyerera mutembiricha yakanyungudutswa solder volatilization uye kuumbwa kwekuzviparadzanisa nevamwe, kuitira kuderedza kuitika kwebhiriji.
b.Kana chinhambwe chiri pakati pepini pads <1.0mm, unogona kugadzira solder ichivharira inki layer kunze kwepadhi kuti uderedze mukana webhiriji, inonyanya kubvisa dense pedhi iri pakati pebhiriji pakati pemajoini anotengeswa, uye iyo huru. kubviswa kwe dense pad boka pamagumo ebhiriji solder majoini mabasa avo akasiyana.Naizvozvo, yepini spacing idiki dense padhi, solder inki uye kuba solder pad zvinofanirwa kushandiswa pamwechete.
Nguva yekutumira: Nov-29-2021