Reflow Oven Ruzivo Rwakabatana

Reflow ovheni inoenderana ruzivo

Reflow soldering inoshandiswa kumusangano weSMT, inova chikamu chakakosha cheSMT maitiro.Basa rayo nderekunyungudutsa solder paste, kuita iyo yepamusoro gungano zvikamu uye PCB yakanyatso sunganidzwa pamwechete.Kana isingakwanisi kudzorwa zvakanaka, ichava nechakaipa pakuvimbika uye hupenyu hwebasa rezvigadzirwa.Kune nzira dzakawanda dze reflow welding.Nzira dzekare dzakakurumbira infrared uye gasi-chikamu.Iye zvino vagadziri vakawanda vanoshandisa mhepo inopisa reflow welding, uye dzimwe nguva dzepamusoro kana dzakananga dzinoshandisa nzira dzekudzokazve, dzakadai sehot core plate, white light focusing, vertical oven, etc. Izvi zvinotevera zvinozoita sumo pfupi kune yakakurumbira inopisa air reflow welding.

 

 

1. Kupisa mhepo kuyerera kwewelding

IN6 ine stand 1

Ikozvino, mazhinji emavira matsva ekusongedzera anodaidzwa kumanikidzwa convection hot air reflow soldering furnaces.Inoshandisa feni yemukati kufuridza mweya unopisa kune kana kutenderedza ndiro yegungano.Imwe mukana wechoto ichi ndechokuti zvishoma nezvishoma uye nguva dzose inopa kupisa kune ndiro yegungano, pasinei nemuvara uye maitiro ezvikamu.Kunyangwe, nekuda kwehukobvu hwakasiyana uye huwandu hwechikamu, kupisa kwekupisa kunogona kunge kwakasiyana, asi iyo yekumanikidza convection choto ichipisa zvishoma nezvishoma, uye mutsauko wekushisa pane imwechete PCB hauna kusiyana zvakanyanya.Uye zvakare, iyo choto inogona kunyatso kudzora tembiricha yakanyanya uye tembiricha yeyakapihwa tembiricha curve, iyo inopa iri nani nzvimbo yekudzikama zone uye inodzorwa zvakanyanya reflux maitiro.

 

2. Kugovera kwekushisa nemabasa

Mukuita kwemhepo inopisa inoyerera welding, iyo solder paste inoda kupfuura nematanho anotevera: solvent volatilization;kuyerera kubviswa kweokisidhi pamusoro peiyo weldment;solder paste kunyunguduka, reflow uye solder paste kutonhora, uye kusimba.Yakajairika tembiricha curve (Profile: inoreva curve yekuti tembiricha yejoint solder paPCB inoshanduka nenguva kana ichipfuura nemuchoto chekuyerera) yakakamurwa kuita preheating nzvimbo, nzvimbo yekuchengetedza kupisa, nzvimbo yekuyerera, uye inotonhorera nzvimbo.(ona pamusoro)

① Preheating nzvimbo: chinangwa chenzvimbo yekupisa ndeye preheat PCB uye zvikamu, kuwana chiyero, uye kubvisa mvura uye inonyungudutsa mune solder paste, kuitira kudzivirira solder paste kudonha uye solder spatter.Tembiricha yekukwira inodzorwa mukati mehumwe hwakakwana (nekukurumidza kunoburitsa kuvhunduka kwemafuta, sekutsemuka kwemultilayer ceramic capacitor, kupuruzira solder, kugadzira mabhora ekutengesa uye majoini ekutengesa asina kukwana solder munzvimbo isina-weld yePCB yese. ; kunonoka kunoderedza kuita kwekuyerera).Kazhinji, tembiricha yekukwira kwepamusoro ndeye 4 ℃ / sec, uye chiyero chekukwira chinoiswa se1-3 ℃ / sec, inova chiyero cheECs Isingasviki 3 ℃ / sec.

② Kuchengetedza kupisa (inoshanda) nzvimbo: inoreva nzvimbo kubva pa120 ℃ kusvika 160 ℃.Chinangwa chikuru ndechekuita kuti kupisa kwechikamu chimwe nechimwe paPCB kuve kwakafanana, kuderedza mutsauko wekushisa zvakanyanya sezvinobvira, uye kuve nechokwadi chokuti solder inogona kuoma zvachose isati yasvika pakupisa kwekutsvaira.Pakupera kwenzvimbo yekudzivirira, okisidhi pane solder pad, solder paste bhora, uye component pini ichabviswa, uye tembiricha yedunhu rese bhodhi ichave yakaenzana.Nguva yekugadzirisa inenge 60-120 seconds, zvichienderana nemhando ye solder.ECS muyero: 140-170 ℃, max120sec;

③ Reflow zone: tembiricha yeheater munzvimbo ino inoiswa padanho repamusoro.Iyo tembiricha yepamusoro yewelding inotsamira pane solder paste inoshandiswa.Zvinowanzokurudzirwa kuwedzera 20-40 ℃ kune inonyungudika tembiricha ye solder paste.Panguva ino, solder mu solder paste inotanga kunyunguduka uye kuyerera zvakare, ichitsiva mvura inoyerera kuti inyorove padhi uye zvikamu.Dzimwe nguva, dunhu rakakamurwawo kuita matunhu maviri: dunhu rekunyungudika uye reflow dunhu.Yakanakira tembiricha curve ndeyekuti nzvimbo yakafukidzwa ne "tip area" mhiri kwekunyungudika kwe solder idiki uye symmetrical, kazhinji, nguva inodarika 200 ℃ i30-40 sec.Muyero weECS ndeye peak temp.: 210-220 ℃, nguva inodarika 200 ℃: 40 ± 3sec;

④ Kutonhodza nzvimbo: kutonhora nekukurumidza sezvinobvira kuchabatsira kuwana majoini akajeka ekutengesa ane chimiro chakazara uye yakaderera yekubata kona.Kutonhora zvishoma nezvishoma kunotungamira mukuwora kwakawanda kwepadhi mutin, zvichikonzera grey uye rough solder majoini, uye zvinototungamira kune isina kusimba tin tsvina uye isina simba solder joint adhesion.Mwero wekutonhodza unowanzo mukati - 4 ℃ / sec, uye inogona kutonhodzwa kusvika pa75 ℃.Kazhinji, kumanikidzwa kutonhora nemhepo inotonhorera kunodiwa.

reflow ovheni IN6-7 (2)

3. Zvinhu zvakasiyana-siyana zvinokanganisa welding performance

Technology zvinhu

Welding pretreatment nzira, kurapwa mhando, nzira, ukobvu, nhamba yezvikamu.Kunyangwe ichipisa, kucheka kana kugadziriswa nedzimwe nzira panguva kubva pakurapwa kusvika kune welding.

Dhizaini yewelding process

Welding nzvimbo: inoreva saizi, gap, gap gwara bhandi (wiring): chimiro, kupisa kwemhepo, kupisa kwechinhu chakashongedzwa: zvinoreva kutungamira, chinzvimbo, kudzvanywa, bonding state, nezvimwe.

Welding mamiriro

Zvinoreva tembiricha yekudziya uye nguva, preheating mamiriro, kupisa, kutonhora kumhanya, welding yekudziya modhi, mutakuri fomu yekupisa sosi (wavelength, kupisa conduction kumhanya, nezvimwewo)

welding zvinhu

Flux: kuumbwa, kutarisisa, chiitiko, nzvimbo yekunyungudika, nzvimbo yekubikira, nezvimwe

Solder: kuumbwa, chimiro, kusvibiswa kwemukati, nzvimbo yekunyungudika, nezvimwe

Base simbi: kuumbwa, chimiro uye thermal conductivity ye base simbi

Viscosity, chaiyo giravhiti uye thixotropic zvimiro zve solder paste

Substrate zvinhu, mhando, cladding simbi, nezvimwe.

 

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Email:info@neodentech.com

 


Nguva yekutumira: May-28-2020

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