Mazhinji akasiyana ma substrates anoshandiswa kumaPCB, asi akakamurwa zvakanyanya kuita mapoka maviri, anoti inorganic substrate zvinhu uye organic substrate zvinhu.
Inorganic substrate zvinhu
Inorganic substrate inonyanya kushandisa mahwendefa eceramic, ceramic circuit substrate material ndeye 96% alumina, munyaya yekuda simba guru, 99% yakachena aluminium zvinhu inogona kushandiswa asi yakakwirira-kuchena kwealuminium kugadzirisa matambudziko, chiyero chegoho chakaderera, saka kushandiswa kwemutengo wakachena wealuminium kwakakwira.Beryllium oxide zvakare zvinhu zveceramic substrate, isimbi oxide, ine yakanaka magetsi ekudzivirira zvivakwa uye yakanakisa thermal conductivity, inogona kushandiswa senge substrate yeakakwira simba density maseketi.
Ceramic circuit substrates inonyanya kushandiswa mune dzakakora uye dzakaonda firimu hybrid integrated circuits, multi-chip micro-assembly circuits, ine zvakanakira izvo organic material circuit substrates haikwanise kuenderana.Semuenzaniso, iyo CTE yeceramic circuit substrate inogona kuenderana neCTE yeLCCC dzimba, saka yakanaka solder kubatana kuvimbika kuchawanikwa pakuunganidza LCCC zvishandiso.Uye zvakare, ceramic substrates inokodzera iyo vacuum evaporation process mukugadzira chip nekuti haiburitse huwandu hukuru hwemagasi adsorbed anokonzera kuderera kwevacuum level kunyangwe ichipisa.Pamusoro pezvo, maceramic substrates anewo tembiricha yekupikisa, kupera kwakanaka kwepamusoro, kugadzikana kwemakemikari, ndiyo inosarudzirwa yedunhu substrate yemasekete akaonda uye akaonda firimu rehybrid uye akawanda-chip micro-assembly circuits.Zvisinei, zvakaoma kugadzirisa kuva guru uye flat substrate, uye haigoni kuitwa kuva multi-chidimbu akasanganiswa chitambi bhodhi chimiro kusangana zvinodiwa otomatiki kugadzirwa Uyezve, nokuda hombe dielectric kugara zvedongo zvinhu, saka izvozvo. hainawo kufanirwa ne-high-speed circuit substrates, uye mutengo wakanyanya kukwirira.
Organic substrate zvinhu
Organic substrate zvinhu zvinogadzirwa nezvinhu zvekusimbisa senge girazi fiber jira (fiber bepa, girazi mat, nezvimwewo), yakamisikidzwa neresin binder, yakaomeswa isina chinhu, yozofukidzwa nefoiri yemhangura, uye yakagadzirwa nekupisa kwakanyanya uye kudzvanywa.Rudzi urwu rwe substrate runodaidzwa kuti copper-clad laminate (CCL), inowanzozivikanwa semhangura-clad mapaneru, ndicho chinhu chikuru chekugadzira maPCB.
CCL mhando dzakawanda, kana iyo inosimbisa zvinhu inoshandiswa kupatsanura, inogona kukamurwa kuita mapepa-based, girazi fiber jira-based, composite base (CEM) uye simbi-yakavakirwa mana mapoka;maererano neiyo organic resin binder inoshandiswa kupatsanura, uye inogona kukamurwa kuita phenolic resin (PE) epoxy resin (EP), polyimide resin (PI), polytetrafluoroethylene resin (TF) uye polyphenylene ether resin (PPO);kana iyo substrate yakaoma uye inochinjika kupatsanura, uye inogona kukamurwa kuita CCL yakaoma uye inoshanduka CCL.
Parizvino rinoshandiswa zvakanyanya mukugadzirwa kwekaviri-sided PCB is epoxy glass fiber circuit substrate, iyo inosanganisa zvakanakira simba rakanaka regirazi faibha uye epoxy resin kuoma, nesimba rakanaka uye ductility.
Epoxy girazi fiber circuit substrate inogadzirwa nekutanga kupinza epoxy resin mugirazi fiber jira kugadzira laminate.Panguva imwecheteyo, mamwe makemikari anowedzerwa, akadai seanorapa, stabilizers, anti-flammability agents, adhesives, etc. Zvadaro foil yemhangura inonamirwa uye yakatsikirirwa kune rimwe kana mativi maviri e laminate kuti iite copper-clad epoxy glass fiber. laminate.Inogona kushandiswa kugadzira akasiyana-siyana-sided, kaviri-sided uye multilayer PCBs.
Nguva yekutumira: Mar-04-2022