I. Pedhi rinopindirana
1. Kupindirana kwemapedhi (mukuwedzera kune pedhi yepasi) zvinoreva kuti kupindirana kwemakomba, mukuboora kunotungamira pakutsemuka kwechibhorani nekuda kwekuchera kwakawanda munzvimbo imwechete, zvichikonzera kukuvara kwegomba.
2. Multilayer board mumakomba maviri anopindirana, akadai segomba rekuzviparadzanisa dhisiki, rimwe gomba rekubatanidza dhisiki (maruva mapedhi), kuitira kuti mushure mekukwevera kunze kwekuita kwakashata kwekuzviparadzanisa dhisiki, zvichikonzera zvimedu.
II.Kushungurudzwa kwegraphics layer
1. Mune mamwe magirafu akaturikidzana kuita zvimwe zvisingabatsiri kubatana, pakutanga mana-layer bhodhi asi akagadzira anopfuura mashanu akaturikidzana mutsetse, kuitira kuti chikonzero chekusanzwisisana.
2. Dhizaini kuchengetedza nguva, Protel software, semuenzaniso, kune ese akaturikidzana emutsara ane Bhodhi layer kudhirowa, uye Bhodhi layer yekukwenya mutsara welabel, kuitira kuti kana chiedza chekudhirowa data, nekuti Board layer haina kusarudzwa, rakapotsa kubatana uye kutyora, kana ichave pfupi-yakatenderedzwa nekuda kwesarudzo yeBhodhi layer yeiyo label line, saka dhizaini kuchengetedza kutendeseka kweiyo giraidhi layer uye yakajeka.
3. Kupesana neyakajairwa dhizaini, senge chikamu chepamusoro dhizaini muPasi dhizaini, welding dhizaini muPamusoro, zvichikonzera kusagadzikana.
III.Hunhu hwekuiswa kwechaotic
1. The character cover Mapedhi SMD solder lug, kuti rakadhindwa bhodhi kuburikidza bvunzo uye chinoumba welding kusagadzikana.
2. Chimiro chechimiro chakanyanya kudiki, zvichikonzera matambudziko muscreen printer machinekudhinda, yakakura kwazvo kuita kuti mavara adhumanane, zvakaoma kusiyanisa.
IV.Iyo single-sided pad aperture marongero
1. Single-sided mapedhi haawanzo dhiriwa, kana gomba richida kuiswa chiratidzo, aperture yaro inofanira kugadzirwa zero.Kana kukosha kwakagadzirirwa kuitira kuti kana data yekuchera inogadzirwa, nzvimbo iyi inooneka mugomba rinoronga, uye dambudziko.
2. Mapedhi ane divi rimwe chete senge kuchera anofanira kunyatsomakwa.
V. Nechivharo chekuzadza kudhirowa mapedhi
Iine filler block yekudhirowa padhi mudhizaini yemutsara inogona kupfuura iyo DRC cheki, asi kugadzirisa hazvigoneke, saka iyo kirasi padhi haigone kuburitsa zvakananga solder resist data, kana pane solder kuramba, iyo filler block nzvimbo ichavharwa ne. iyo solder inopikisa, zvichikonzera kuomerwa kwekutengesa mudziyo.
VI.Iyo yemagetsi yepasi layer iinewo padhi yemaruva uye yakabatanidzwa kune mutsara
Nemhaka yekuti magetsi akagadzirwa senzira yemaruva, pasi uye mufananidzo chaiwo pabhodhi rakadhindwa zvinopesana, mitsara yose yekubatanidza ndeye mitsara yega, iyo mugadziri anofanira kunge akajeka.Pano nenzira, kudhirowa mapoka akati wandei emasimba kana akati wandei pasi pekuzviparadzanisa mutsara kunofanirwa kungwarira kuti usasiye gap, kuitira kuti mapoka maviri emagetsi emagetsi pfupi-circuit, uye anogona kukonzera kubatana kwenzvimbo yakavharwa (kuitira kuti boka re simba rakapatsanurwa).
VII.Chiyero chekugadzirisa hachina kunyatsotsanangurwa
1. A single panel dhizaini mu TOP layer, senge kusawedzera tsananguro yezvakanaka nezvakaipa do, zvichida yakagadzirwa kubva pabhodhi rakaiswa pane mudziyo uye kwete yakanaka welding.
2. semuenzaniso, mana-layer board design uchishandisa TOP mid1, mid2 pasi pezvikamu zvina, asi kugadzirisa hakuna kuiswa muhurongwa uhu, hunoda mirairo.
VIII.Dhizaini yevhavha yekuzadza yakawandisa kana yekuzadza block ine mutete wakanyanya kuzadza
1. Pane kurasikirwa kwechiedza chekudhirowa data yakagadzirwa, chiedza chekudhirowa data haina kukwana.
2. Nemhaka yokuti chivharo chekuzadza muchiedza chekudhirowa data kushandiswa chinoshandiswa mutsara nemutsara kudhirowa, saka chiyero chechiedza chekudhirowa data chakagadzirwa chakakura kwazvo, chakawedzera kuoma kwekugadzirisa data.
IX.Surface Mount Device Pad ipfupi
Iyi ndeyekupfuura uye kuburikidza nekuyedzwa, kune yakanyanya kuomesesa pamusoro pegomo mudziyo, nzvimbo pakati petsoka dzayo mbiri idiki, iyo padhi zvakare yakatetepa, yekuisa bvunzo tsono, inofanirwa kunge iri kumusoro uye pasi (kuruboshwe nekurudyi) yakadzedzereka chinzvimbo, senge padhi dhizaini ipfupi, kunyangwe isingakanganise kuisirwa kwechishandiso, asi ichaita kuti tsono yebvunzo iite isiri yekuvhurika chinzvimbo.
X. Kupatsanurwa kwegridi yenzvimbo hombe kudiki zvakanyanya
Kuumbwa kwenzvimbo hombe yegidhi mutsara nemutsara pakati pemupendero idiki kwazvo (isingasviki 0.3mm), mukugadzira yakadhindwa redunhu bhodhi, nhamba yekufambisa maitiro mushure mekuvandudzwa kwemumvuri zviri nyore kugadzira yakawanda yakaputsika firimu. yakasungirirwa pabhodhi, zvichiita kuti mitsara yakaputsika.
XI.Yakakura-nzvimbo yemhangura foil kubva kunze kwechinhambwe chiri pedyo zvakanyanya
Hombe nzvimbo yemhangura foil kubva kunze furemu inofanira kuva kanenge 0.2mm spacing, nokuti muhuyo chimiro, akadai milling kune foil mhangura zviri nyore kukonzera mhangura foil warping uye kunokonzerwa nedambudziko solder kuramba kure.
XII.Chimiro chekugadzirwa kwemuganhu hachina kujeka
Vamwe vatengi muKeep layer, Board layer, Top over layer, etc. vakagadzirwa mutsara wechimiro uye iyi mitsetse yechimiro haipindire, zvichiita kuti vagadziri vePCb vaomerwe kuona kuti ndeupi mutsara wechimiro uchakunda.
XIII.Zvisina kuenzana graphic dhizaini
Kusaenzana plating layer kana plating giraidhi inokanganisa kunaka.
XIV.Iyo mhangura yekuisa nzvimbo yakakura zvakanyanya kana kushandiswa kwegridi mitsetse, kudzivirira SMT blistering.
Nguva yekutumira: Jan-07-2022