Kuti usangane nezvinodiwa zvekupisa zvechishandiso, vagadziri vanofanirwa kuenzanisa hunhu hwekupisa hwemhando dzakasiyana dzemiconductor package.Muchikamu chino, Nexperia inokurukura nzira dzinopisa dzewaya bhondi mapakeji uye chip bond mapakeji kuitira kuti vagadziri vagone kusarudza imwe yakakodzera pasuru.
Mafambisirwo eThermal Conduction muWire Bonded Devices
Iyo yekutanga kupisa sink muwaya yakasungirirwa mudziyo inobva pajoinhi rengedzo kuenda kune solder majoini payakadhindwa redunhu board (PCB), sezvakaratidzwa muMufananidzo 1. Kutevera algorithm iri nyore yekutanga-odha yekufungidzira, mhedzisiro yesimba rechipiri. chiteshi chekushandisa (chinoratidzwa mumufananidzo) hachikoshese mukuverenga kwekupisa kwekupisa.
Thermal channels muwaya bonded midziyo
Dual thermal conduction chiteshi mune SMD mudziyo
Musiyano uripo pakati peSMD package uye waya yakasungirirwa pasuru maererano nekupisa kupisa ndeyekuti kupisa kunobva panosangana dhizaini kunogona kubviswa pamwe chete nematanho maviri akasiyana, kureva, kuburikidza neleadframe (sezvakaita tambo dzakasungwa mapakeji) uye kuburikidza ne clip frame.
Kutamisa kupisa mune chip bonded package
Tsanangudzo yekupikiswa kwekupisa kweiyo junction kune solder joint Rth (j-sp) inowedzera kuomeswa nekuvapo kwemareferensi maviri ekutengesa majoini.Aya mareferensi mapoinzi anogona kunge aine tembiricha dzakasiyana, zvichiita kuti kupisa kwekupisa kuve network yakafanana.
Nexperia inoshandisa nzira imwechete kubvisa iyo Rth(j-sp) kukosha kune ese ari maviri chip-bonded uye waya-anotengeswa zvishandiso.Ukoshi uhwu hunoratidza nzira huru yekupisa kubva kune chip kuenda kune leadframe kune masolder majoini, ichiita kukosha kweiyo chip-bonded midziyo yakafanana neiyo yakakosha yewaya-inotengeswa zvishandiso mune yakafanana PCB marongero.Nekudaro, chiteshi chechipiri hachishandiswe zvizere kana uchibvisa iyo Rth(j-sp) kukosha, saka iyo yakazara yekupisa kugona kwemudziyo inowanzokwira.
Muchokwadi, yechipiri yakakosha kupisa sink chiteshi inopa vagadziri mukana wekuvandudza PCB dhizaini.Semuenzaniso, nokuda kwechigadzirwa chetambo-soldered, kupisa kunogona kungobviswa kuburikidza negeji imwe (yakawanda yekupisa kwe diode inoputika kuburikidza nepini ye cathode);yeclip-bonded mudziyo, kupisa kunogona kubviswa pamaterminal ese ari maviri.
Simulation yeThermal Performance yeSemiconductor Devices
Kuedzesera kwakaratidza kuti mashandiro ekupisa anogona kuvandudzwa zvakanyanya kana ese materminal emudziyo paPCB aine nzira dzekupisa.Semuenzaniso, muCFP5-packaged PMEG6030ELP diode (Mufananidzo 3), 35% yekupisa inotamirwa kumapini anode kuburikidza nemhangura yemhangura uye 65% inotamirwa kumapini e cathode kuburikidza ne leadframes.
CFP5 yakarongedzwa diode
"Kuyedza kutevedzera kwakasimbisa kuti kupatsanura singi yekupisa kuita zvikamu zviviri (sezvinoratidzwa mumufananidzo 4) kunobatsira pakupisa kupisa.
Kana 1 cm² heatsink yakakamurwa kuita maviri 0.5 cm² heatsinks akaiswa pasi peimwe neimwe yematerminal maviri, huwandu hwesimba hunogona kubviswa ne diode patembiricha imwechete inowedzera ne6%.
Maviri 3 cm² heatsinks anowedzera kupera kwesimba neanosvika makumi maviri muzana kana zvichienzaniswa neyakajairwa kupisa sink dhizaini kana 6 cm² heatsink inosungirirwa pacathode chete.
Thermal Simulation Mhedzisiro ine Heat Sinks munzvimbo Dzakasiyana uye Nzvimbo dzeBhodhi
Nexperia Inobatsira Vagadziri Kusarudza Mapakeji Anoenderana Nemashandisirwo Avo
Vamwe vanogadzira semiconductor mudziyo havape vagadziri ruzivo rwunodiwa kuti vaone kuti ndeipi rudzi rwepakeji ichapa zvirinani kupisa kwekushandisa kwavo.Muchinyorwa chino, Nexperia inotsanangura nzira dzinopisa muwaya dzayo dzakasungwa uye chip bonded zvishandiso kubatsira vagadziri kuita sarudzo dziri nani dzekushandisa kwavo.
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Nguva yekutumira: Sep-13-2023