Misimboti misere yePCBA manufacturability dhizaini

1. Inosarudzwa pamusoro pegungano uye crimping components
Surface musangano zvikamu uye crimping zvinhu, ine yakanaka tekinoroji.
Nekuvandudzwa kwechikamu chekurongedza tekinoroji, zvinhu zvakawanda zvinogona kutengwa zve reflow welding package, kusanganisira plug-in zvinhu zvinogona kushandisa kuburikidza negomba reflow welding.Kana iyo dhizaini ichigona kuwana yakazara pamusoro peungano, ichavandudza zvakanyanya kushanda uye kunaka kwekusangana.
Matamping components anonyanya kuwanda-pini zvinongedzo.Iri rudzi rwekurongedza zvakare rine yakanaka manufacturability uye kuvimbika kwekubatanidza, inovawo chikamu chinodiwa.

2. Kutora PCBA gungano pamusoro sechinhu, chikero chekurongedza uye pini spacing zvinoonekwa sese.
Packaging scale uye pini spacing ndizvo zvakanyanya kukosha zvinokanganisa maitiro ebhodhi rese.Pachimiro chekusarudza zvikamu zvekusangana kwepamusoro, boka remapakeji ane akafanana tekinoroji zvivakwa kana akakodzera kudhinda simbi mesh yehumwe ukobvu inofanira kusarudzirwa PCB ine saizi chaiyo uye density yegungano.Semuenzaniso, nhare mbozha bhodhi, iyo yakasarudzwa pasuru inokodzera welding paste kudhinda ne 0.1mm gobvu simbi mesh.

3. Kupfupisa nzira yekugadzira
Iyo ipfupi nzira yemaitiro, iyo yakakwirira yekugadzirwa kwayo uye yakanyanya kuvimbika mhando.Iyo yakakwana process nzira dhizaini ndeye:
Single-side reflow welding;
Kaviri-sided reflow welding;
Kaviri divi reflow welding + wave welding;
Kaviri divi reflow welding + yakasarudzika wave soldering;
Double side reflow welding + manual welding.

4. Optimize chikamu marongerwo
Principle Component dhizaini dhizaini inonyanya kureva kutaridzika kwechikamu uye dhizaini yepakati.Kurongeka kwezvikamu kunofanirwa kusangana nezvinodiwa zvewelding process.Scientific uye inonzwisisika marongerwo anogona kuderedza kushandiswa kweakaipa solder majoini uye tooling, uye optimize dhizaini simbi mesh.

5. Funga nezvekugadzirwa kwe solder pad, solder resistance uye steel mesh window
Dhizaini ye solder pad, solder resistance uye simbi mesh hwindo inosarudza kugovera chaiko kwesolder paste uye maitiro ekugadzira solder joint.Kuronga dhizaini yewelding pad, welding resistance uye simbi mesh inoita basa rakakosha mukuvandudza chiyero chewelding.

6. Tarisa pane zvitsva zvekuputira
Izvo zvinonzi new packaging, hazvireve zvizere kune nyowani musika kurongedza, asi inoreva kune yavo kambani haina ruzivo mukushandiswa kwemapakeji iwayo.Nekuunza kunze kwemapakeji matsva, diki batch process process kusimbiswa kunofanirwa kuitwa.Vamwe vanogona kushandisa, hazvireve kuti iwe unogona zvakare kushandisa, kushandiswa kwenzvimbo kunofanirwa kuitwa kuyedza, kunzwisisa maitiro maitiro uye dambudziko spectrum, tenzi zviyedzo.

7. Tarisa paBGA, chip capacitor uye crystal oscillator
BGA, chip capacitors uye crystal oscillators akajairika kushushikana-sensitive zvikamu, izvo zvinofanirwa kudzivirirwa zvakanyanya sezvinobvira muPCB bending deformation muwelding, musangano, workshop turnover, chekufambisa, kushandiswa uye zvimwe zvinongedzo.

8. Nyaya dzekudzidza kuvandudza mitemo yekugadzira
Manufacturability dhizaini mitemo inotorwa kubva mukugadzira maitiro.Izvo zvakakosha zvikuru kuenderera mberi nekugadzirisa uye kugadzirisa mitemo yekugadzira maererano nekuenderera kunoitika kwekusangana kwakashata kana nyaya dzekukundikana kuvandudza manufacturability dhizaini.