1. BGA(bhora giredhi array)
Bhora rekuonana kuratidza, imwe yemapakeji emhando yepamusoro.Mapundu ebhora anogadzirwa kuseri kweiyo yakadhindwa substrate kutsiva mapini zvinoenderana nenzira yekuratidzira, uye LSI chip inounganidzwa pamberi peiyo yakadhindwa substrate yobva yavharwa neyakaumbwa resin kana nzira yekubikisa.Izvi zvinonziwo bump display carrier (PAC).Pini dzinogona kudarika mazana maviri uye imhando yepasuru inoshandiswa kune akawanda-pini LSIs.Muviri wepasuru unogonawo kuitwa diki pane QFP (quad side pin flat package).Semuyenzaniso, 360-pini BGA ine 1.5mm pini centers ingori 31mm square, ukuwo 304-pini QFP ine 0.5mm pini centre i40mm square.Uye iyo BGA haifanirwe kunetseka nezve pini deformation seQFP.Pasuru iyi yakagadziridzwa neMotorola kuUnited States uye yakatanga kutorwa mumidziyo yakaita senhare dzinotakurika, uye ingangove yakakurumbira muUnited States yemakomputa emunhu mune ramangwana.Pakutanga, pini (bump) yepakati chinhambwe cheBGA i1.5mm uye nhamba yepini i225. 500-pini BGA iri kuvandudzwawo nevamwe vanogadzira LSI.dambudziko reBGA ndiko kutariswa kwekuonekwa mushure mekudzokazve.
2. BQFP(quad flat package ine bumper)
Iyo quad flat package ine bumper, imwe yemapakeji eQFP, ine mabumps (bumper) pamakona mana epasuru yemuviri kudzivirira kukotama kwepini panguva yekutumira.Vagadziri veUS semiconductor vanoshandisa pasuru iyi kunyanya mumaseketi akadai semicroprocessors uye ASICs.Pin pakati chinhambwe 0.635mm, huwandu hwepini kubva pa84 kusvika 196 kana zvakadaro.
3. Bump solder PGA(butt joint pin grid array) Alias of surface mount PGA.
4. C-(ceramic)
Mucherechedzo weceramic package.Semuenzaniso, CDIP inoreva ceramic DIP, iyo inowanzoshandiswa mukuita.
5. Cerdip
Ceramic double in-line package yakavharwa negirazi, inoshandiswa ECL RAM, DSP (Digital Signal Processor) nemamwe masekete.Cerdip ine girazi hwindo inoshandiswa kune UV erasure mhando EPROM uye microcomputer maseketi ane EPROM mukati.Iyo pini yepakati kureba ndeye 2.54mm uye huwandu hwepini kubva pa8 kusvika 42.
6. Cerquad
Imwe yemapakeji epamusoro, iyo ceramic QFP ine underseal, inoshandiswa kurongedza logic LSI maseketi akadai seDSPs.Cerquad ine hwindo inoshandiswa kurongedza EPROM maseketi.Kupisa kupisa kuri nani pane epurasitiki QFPs, inobvumira 1.5 kusvika 2W yesimba pasi pemamiriro ekunze ekutonhora kwemhepo.Nekudaro, mutengo wepasuru ndeye 3 kusvika 5 nguva dzakakwirira pane epurasitiki QFPs.Pini yepakati kureba ndeye 1.27mm, 0.8mm, 0.65mm, 0.5mm, 0.4mm, nezvimwewo. Huwandu hwepini hunotangira pa32 kusvika pa368.
7. CLCC (ceramic leaded chip carrier)
Ceramic leaded chip carrier ine mapini, imwe yeapamusoro gomo pasuru, mapini anotungamirwa kubva kumativi mana epakeji, muchimiro che ding.Iine hwindo repasuru yeUV erasure type EPROM uye microcomputer reketi ine EPROM, nezvimwewo .. Pasuru iyi inonzi zvakare QFJ, QFJ-G.
8. COB (chip pabhodhi)
Chip pabhodhi pasuru ndeimwe yeasina bare chip mounting tekinoroji, semiconductor chip inoiswa pane yakadhindwa redunhu bhodhi, iyo magetsi yekubatanidza pakati chip uye substrate inoitwa nelead stitching nzira, kubatanidza kwemagetsi pakati pechip uye substrate kunoitwa nelead stitching nzira. , uye yakafukidzwa neresin kuti ive nechokwadi chekuvimbika.Kunyangwe COB iriyo yakapusa isina chip mounting tekinoroji, asi density yayo yepakeji yakaderera zvakanyanya kune TAB uye inverted chip soldering tekinoroji.
9. DFP(dual flat package)
Double side pin flat package.Iri ndiro zita reSOP.
10. DIC(dual in-line ceramic package)
Ceramic DIP (ine girazi chisimbiso) alias.
11. DIL(dual in-line)
DIP alias (ona DIP).Vagadziri veEuropean semiconductor vanowanzo shandisa zita iri.
12. DIP(dual in-line package)
Double in-line package.Imwe yecartridge package, mapini anotungamirwa kubva kumativi ese epasuru, iyo pasuru zvinhu zvine marudzi maviri epurasitiki uye ceramic.DIP ndiyo inonyanya kufarirwa cartridge package, zvikumbiro zvinosanganisira standard logic IC, memory LSI, microcomputer circuits, etc.mamwe mapakeji ane hupamhi hwe7.52mm uye 10.16mm anonzi skinny DIP uye slim DIP zvichiteerana.Pamusoro pezvo, ceramic DIPs yakavharwa negirazi yakadzika yakanyungudika inonziwo cerdip (ona cerdip).
13. DSO(dual diki out-lint)
Chirevo cheSOP (ona SOP).Vamwe vanogadzira semiconductor vanoshandisa zita iri.
14. DICP(dual tepi mutakuri wepasuru)
Imwe yeTCP (tepi inotakura pasuru).Mapini anogadzirwa pane insulating tepi uye anotungamira kunze kubva kumativi ese epasuru.Nekuda kwekushandiswa kweTAB (otomatiki tepi inotakura solder) tekinoroji, iyo pasuru mbiri yakatetepa kwazvo.Inowanzoshandiswa kuLCD mutyairi LSIs, asi mazhinji acho akagadzirwa-akagadzirwa.Pamusoro pezvo, 0.5mm gobvu ndangariro LSI kabhuku pasuru iri pasi pekuvandudzwa.MuJapan, iyo DICP inodaidzwa kuti DTP maererano neEIAJ (Electronic Industries and Machinery of Japan) standard.
15. DIP(dual tepi mutakuri wepasuru)
Zvakafanana nepamusoro.Zita reDTCP muyero yeEIAJ.
16. FP(flat package)
Flat package.Chirevo cheQFP kana SOP (ona QFP neSOP).Vamwe vanogadzira semiconductor vanoshandisa zita iri.
17. flip-chip
Flip-chip.Imwe ye-bare-chip yekurongedza tekinoroji umo simbi bump inogadzirwa munzvimbo ye electrode yeLSI chip uye ipapo simbi bump inomanikidzwa-inotengeswa kunzvimbo ye electrode pane yakadhindwa substrate.Nzvimbo inogarwa nepasuru yacho yakangofanana nekukura kwechip.Ndiyo idiki uye yakatetepa pane ese ekurongedza matekinoroji.Zvisinei, kana iyo coefficient yekuwedzera kwekushisa kwe substrate yakasiyana neiyo LSI chip, inogona kuita pajojo uye nokudaro inokanganisa kuvimbika kwekubatana.Naizvozvo, zvinodikanwa kusimbisa iyo LSI chip neresin uye kushandisa substrate zvinhu zvine inenge yakafanana coefficient yekuwedzera kwekupisa.
18. FQFP(yakanaka pitch quad flat package)
QFP ine pini diki yepakati kureba, kazhinji isingasviki 0.65mm (ona QFP).Vamwe vanogadzira conductor vanoshandisa zita iri.
19. CPAC(globe top pad array carrier)
Motorola's alias yeBGA.
20. CQFP(quad fiat package ine ring ring)
Quad fiat package ine murindi mhete.Imwe yepurasitiki QFPs, mapini akafukidzwa neinodzivirira resin mhete kudzivirira kukotama uye deformation.Usati waunganidza LSI pane yakadhindwa substrate, mapini anochekwa kubva mhete yevarindi uye akaitwa seagull wing shape (L-shape).Pasuru iyi iri mukugadzirwa kwevanhu vakawanda paMotorola, USA.Iyo pini yepakati kureba ndeye 0.5mm, uye huwandu hwepamusoro hwepini hunosvika 208.
21. H-(ine singi yekupisa)
Inoratidza chiratidzo chine kupisa sink.Semuenzaniso, HSOP inoratidza SOP ine heat sink.
22. pini grid array (pamusoro pegomo rudzi)
Iyo yekumusoro gomo yemhando yePGA inowanzova cartridge type package ine pini kureba ingangoita 3.4mm, uye iyo yekumusoro yemhando yePGA ine ratidziro yepini pazasi pepakeji nehurefu kubva pa1.5mm kusvika 2.0mm.Sezvo nzvimbo yepini yepakati ingori 1.27mm, inova hafu yehukuru hwekaturiji mhando yePGA, muviri wepasuru unogona kuitwa diki, uye huwandu hwepini hunodarika iyo yemhando yecartridge (250-528), saka ndiyo pasuru inoshandiswa kune yakakura-chiyero logic LSI.Iwo mapakeji substrates ari multilayer ceramic substrates uye girazi epoxy resin kudhinda substrates.Kugadzirwa kwemapakeji ane multilayer ceramic substrates kwave kushanda.
23. JLCC (J-lead chip carrier)
J-yakaita pin chip carrier.Inoreva CLCC ine hwindo uye nehwindo ceramic QFJ alias (ona CLCC uye QFJ).Vamwe vevagadziri vesemi-conductor vanoshandisa zita.
24. LCC (Leadless chip carrier)
Pinless chip mutakuri.Inoreva pamusoro pegomo pasuru umo chete maelectrodes pamativi mana eceramic substrate ari kusangana pasina mapini.Yakakwira-kumhanya uye yakakwira-frequency IC package, inozivikanwawo seceramic QFN kana QFN-C.
25. LGA (land grid array)
Bata kuratidza package.Ipasuru ine ruzhinji rwematanho padivi rezasi.Kana yaunganidzwa, inogona kuiswa mukati me socket.Kune mazana maviri nemakumi maviri nemanomwe ekubatika (1.27mm yepakati chinhambwe) uye 447 contacts (2.54mm yepakati chinhambwe) eceramic LGAs, ayo anoshandiswa mune yakakwirira-kumhanya logic LSI maseketi.LGAs inogona kugarisa mamwe mapini ekupinza uye ekubuda mupakeji diki pane QFPs.Mukuwedzera, nekuda kwekushomeka kwakaderera kwevatungamiri, inokodzera high-speed LSI.Zvisinei, nekuda kwekuoma uye kudhura kwekugadzira zvigadziko, hazvishandiswi zvakanyanya ikozvino.Kudiwa kwavo kunotarisirwa kuwedzera mune ramangwana.
26. LOC (lead pane chip)
LSI yekurongedza tekinoroji chimiro umo kumucheto kwemberi kweiyo inotungamira furemu iri pamusoro pechip uye bumpy solder joint inogadzirwa padyo nepakati pechip, uye kubatanidza kwemagetsi kunoitwa nekusona zvinotungamira pamwechete.Kuenzaniswa nechimiro chepakutanga apo inotungamira furemu inoiswa padhuze nedivi rechip, iyo chip inogona kugariswa mune imwechete saizi package ine hupamhi hunosvika 1mm.
27. LQFP (yakaderera profile quad flat package)
Thin QFP inoreva maQFP ane pasuru yemuviri ukobvu hwe1.4mm, uye ndiro zita rinoshandiswa neJapan Electronics Machina Indasitiri Association zvinoenderana neiyo itsva QFP fomu factor yakatarwa.
28. L-QUAD
Imwe yekeramic QFPs.Aluminium nitride inoshandiswa pasuru substrate, uye thermal conductivity yechigadziko ndeye 7 kusvika 8 times yakakwirira kupfuura iyo yealuminium oxide, ichipa nani kupisa kupisa.Iyo furemu yepakeji inogadzirwa nealuminium oxide, uye chip yakavharwa nenzira yekuputira, nekudaro ichidzvinyirira mutengo.Iyo pasuru yakagadziridzwa logic LSI uye inogona kugamuchira W3 simba pasi peyakasikwa mhepo inotonhorera mamiriro.Iwo 208-pini (0.5mm centre pitch) uye 160-pini (0.65mm centre pitch) mapakeji eLSI logic akagadzirwa uye akaiswa mukugadzirwa kwakawanda muna Gumiguru 1993.
29. MCM (multi-chip module)
Multi-chip module.Pakeji umo akawanda semiconductor asina machipisi anounganidzwa pane wiring substrate.Zvinoenderana neiyo substrate zvinhu, inogona kukamurwa muzvikamu zvitatu, MCM-L, MCM-C uye MCM-D.MCM-L igungano rinoshandisa yakajairika girazi epoxy resin multilayer yakadhindwa substrate.Iri shoma uye haina kudhura.MCM-C chikamu chinoshandisa gobvu firimu tekinoroji kugadzira multilayer wiring neceramic (alumina kana girazi-ceramic) se substrate, yakafanana nefirimu gobvu hybrid ICs uchishandisa multilayer ceramic substrates.Hapana musiyano unokosha pakati pezviviri izvi.Wiring density yakakwira kupfuura iyo yeMCM-L.
MCM-D chikamu chinoshandisa tekinoroji-yefirimu kugadzira multilayer wiring neceramic (alumina kana aluminium nitride) kana Si uye Al sema substrates.Iyo wiring density ndiyo yakakwirira pakati pemhando nhatu dzezvikamu, asi mutengo wakakwira zvakare.
30. MFP(mini flat package)
Diki flat package.Iri zita repurasitiki SOP kana SSOP (ona SOP uye SSOP).Iro zita rinoshandiswa nevamwe vanogadzira semiconductor.
31. MQFP(metric quad flat package)
Chikamu cheQFPs maererano neJEDEC (Joint Electronic Devices Committee) chiyero.Inoreva yakajairwa QFP ine pini yepakati chinhambwe che 0.65mm uye ukobvu hwemuviri hwe3.8mm kusvika 2.0mm (ona QFP).
32. MQUAD(simbi quad)
A QFP package yakagadzirwa naOlin, USA.Iyo base plate uye chivharo chakagadzirwa nealuminium uye chakanamwa neadhesive.Inogona kubvumidza 2.5W ~ 2.8W yesimba pasi peyakasikwa mhepo-inotonhorera mamiriro.Nippon Shinko Kogyo akapihwa rezinesi rekutanga kugadzira muna 1993.
33. MSP(mini square package)
QFI alias (ona QFI), padanho rekutanga rebudiriro, rinonyanya kunzi MSP, QFI izita rakanyorerwa neJapan Electronics Machinery Industry Association.
34. OPMAC(pamusoro pekuumbwa padhi array carrier)
Molded resin sealing bump display carrier.Iro zita rinoshandiswa neMotorola kune yakaumbwa resin yekuisa chisimbiso BGA (ona BGA).
35. P-(purasitiki)
Inoratidza notation yepurasitiki package.Semuenzaniso, PDIP inoreva plastiki DIP.
36. PAC(pad array carrier)
Bump display carrier, alias yeBGA (ona BGA).
37. PCLP(yakadhindwa redunhu bhodhi leadless package)
Yakadhindwa redunhu bhodhi leadless package.Pini yepakati chinhambwe chine maviri zvirevo: 0.55mm uye 0.4mm.Parizvino muchikamu chebudiriro.
38. PFPF(plastic flat package)
Plastic flat package.Mazita epurasitiki QFP (ona QFP).Vamwe vagadziri veLSI vanoshandisa zita.
39. PGA(pini grid array)
Pin array package.Imwe yemapakeji emhando yekaturiji umo mapini akatwasuka padivi rezasi akarongwa muratidziro patani.Chaizvoizvo, multilayer ceramic substrates inoshandiswa pasuru substrate.Mumamiriro ezvinhu apo zita rezvinyorwa harina kunyatsoratidzwa, mazhinji maPGA eceramic, ayo anoshandiswa kune yakakwirira-kumhanya, yakakura-chiyero logic LSI maseketi.Mutengo wacho wakakwira.Pini nzvimbo dzinowanzoita 2.54mm kure uye pini kuverenga kubva pa64 kusvika pa447. Kuderedza mutengo, iyo pasuru substrate inogona kutsiviwa negirazi epoxy yakadhindwa substrate.Plastic PG A ine 64 kusvika 256 pini inowanikwawo.Kune zvakare ipfupi pini pamusoro pegomo remhando yePGA (touch-solder PGA) ine pini yepakati chinhambwe che1.27mm.(Ona pamusoro pegomo remhando yePGA).
40. Nguruve kumashure
Packaged package.A ceramic package ine socket, yakafanana muchimiro kune DIP, QFP, kana QFN.Inoshandiswa mukugadzirwa kwemidziyo ine microcomputer yekuongorora mashandiro echirongwa chechirongwa.Semuyenzaniso, iyo EPROM inopinzwa musocket yedebugging.Iyi pasuru ndeye tsika chigadzirwa uye haiwanikwe zvakanyanya mumusika.
Nguva yekutumira: May-27-2022