Packaging hurema hunonyanya kusanganisira lead deformation, base offset, warpage, chip breakage, delamination, voids, kusarongeka kurongedza, maburrs, zvimedu zvekunze uye kurapa kusina kukwana, nezvimwe.
1. Lead deformation
Lead deformation inowanzoreva kutungamira kusimuka kana deformation kunokonzerwa panguva yekuyerera kwepurasitiki sealant, iyo inowanzo ratidzwa nechiyero x / L pakati peiyo yakanyanya lateral lead displacement x uye inotungamira kureba L. Lead bending inogona kutungamirira kune magetsi shorts (kunyanya mune yakakwirira density I/O mudziyo mapakeji).Dzimwe nguva kushushikana kunokonzerwa nekukotama kunogona kutungamira mukutsemuka kwechisungo kana kudzikiswa kwesimba rebhondi.
Zvinhu zvinokanganisa lead bonding zvinosanganisira dhizaini dhizaini, lead dhizaini, lead zvinhu uye saizi, kuumba epurasitiki zvivakwa, lead bonding process, uye kurongedza maitiro.Lead parameters inokanganisa lead bending inosanganisira lead dhayamita, lead kureba, lead break load uye lead density, nezvimwe.
2. Base offset
Base offset inoreva deformation uye offset yemutakuri (chip base) inotsigira chip.
Zvinhu zvinokanganisa base shift zvinosanganisira kuyerera kweiyo molding compound, leadframe assembly dhizaini, uye zvinhu zvemukati zvemolding compound uye leadframe.Mapakeji akadai seTSOP neTQFP anotapukirwa nebasi shift uye pini deformation nekuda kwekutetepa kwavo.
3. Warpage
Warpage ndiko kukotama kwekunze-kwendege uye deformation yemudziyo wepakeji.Warpage inokonzerwa nekuumbwa kwemaitiro inogona kutungamira kune akati wandei ekuvimbika nyaya senge delamination uye chip cracking.
Warpage inogonawo kutungamirira kune zvakasiyana-siyana zvekugadzira zvinetso, zvakadai seplasticized ball grid array (PBGA) zvishandiso, apo warpage inogona kutungamirira kune murombo solder bhora coplanarity, zvichiita kuti kuisa matambudziko panguva reflow mudziyo kuti gungano kuti rakadhindwa redunhu bhodhi.
Warpage mapatani anosanganisira matatu marudzi emapateni: mukati concave, yekunze convex uye yakasanganiswa.Mumakambani esemiconductor, concave dzimwe nguva inonzi "smiley face" uye convex se "cry face".Izvo zvikuru zvinokonzeresa warpage zvinosanganisira CTE mismatch uye kurapa / compression shrinkage.Iwo ekupedzisira haana kutariswa zvakanyanya pakutanga, asi tsvakiridzo yakadzama yakaratidza kuti shrinkage yekemikari yemuumbi wekuumbwa inoitawo basa rakakosha muIC mudziyo warpage, kunyanya mumapakeji ane ukobvu hwakasiyana pamusoro uye pasi pechip.
Munguva yekurapa uye mushure mekurapa, iyo yekuumba musanganiswa ichaita makemikari shrinkage pane yakakwirira yekurapa tembiricha, iyo inonzi "thermochemical shrinkage".Iyo kemikari shrinkage inoitika panguva yekurapa inogona kuderedzwa nekuwedzera tembiricha yekuchinja kwegirazi uye nekudzikisa shanduko mucoefficient yekuwedzera kwekupisa kwakatenderedza Tg.
Warpage inogonawo kukonzerwa nezvinhu zvakaita sekuumbwa kwemushonga wekuumba, hunyoro muchikamu chekuumba, uye geometry yepakeji.Nekudzora iyo yekuumba zvinhu uye kuumbwa, maitiro paramita, pasuru chimiro uye pre-encapsulation nharaunda, package warpage inogona kudzikiswa.Mune zvimwe zviitiko, warpage inogona kubhadharwa nekuputira kuseri kwemusangano wemagetsi.Semuenzaniso, kana kubatanidza kwekunze kwebhokisi hombe receramic kana multilayer board iri kudivi rimwe chete, kuvaputira kudivi rekuseri kunogona kuderedza warpage.
4. Kuputsika kwechip
Izvo zvinonetsa zvinogadzirwa mukurongedza zvinogona kutungamira mukuputsika kwechip.Iyo yekurongedza maitiro inowanzo wedzera iyo micro-cracks inoumbwa mune yapfuura gungano maitiro.Wafer kana chip thinning, kuseri kwekugaya, uye chip bonding ese matanho anogona kutungamira kumera kwepakatsemuka.
Chipi chakatsemuka, chakakundikana nemuchina hazvirevi hazvo kuti zvinokonzeresa kutadza kwemagetsi.Kana kuputika kwechip kuchizokonzera kutadza kwemagetsi ipapo ipapo zvinoenderana nenzira yekukura kwe crack.Semuyenzaniso, kana kutsemuka kuchionekwa kuseri kwechipi, kunogona kusakanganisa chero zvimiro zvinonetsa.
Nekuti silicon wafers dzakatetepa uye brittle, wafer-level kurongedza kunowanzo konzeresa kuputika kwechip.Naizvozvo, maparamita ekuita senge clamping kudzvanywa uye kuumba shanduko yekuchinja mukufambiswa kwekuumbwa kunofanirwa kudzorwa zvakanyanya kudzivirira kuputika kwechip.3D akaturikidzana mapakeji anowanzo putika chip nekuda kweiyo stacking process.Iwo magadzirirwo anokanganisa kuputika kwechip mu 3D mapakeji anosanganisira chip stack chimiro, substrate ukobvu, vhoriyamu yekuumba uye mold sleeve ukobvu, nezvimwe.
Nguva yekutumira: Feb-15-2023