1. Kupisa sink chimiro, ukobvu uye nzvimbo yekugadzira
Zvinoenderana nezvinodiwa zvekupisa dhizaini yezvinodiwa zvinopisa zvinopisa zvinofanirwa kutariswa zvizere, zvinofanirwa kuve nechokwadi chekuti tembiricha yekusangana yezvikamu zvinogadzira kupisa, PCB yepamusoro tembiricha kusangana nekugadzirwa kwechigadzirwa zvinodiwa.
2. Heat sink mounting surface roughness design
Nekuda kwezvinoda zvekudzora kupisa kwepamusoro pezvinhu zvinogadzira kupisa, singi yekupisa uye zvikamu zveiyo inokwira pamusoro roughness zvinofanirwa kuvimbiswa kusvika 3.2µm kana kunyange 1.6µm, yakawedzera nzvimbo yekusangana yepasi pesimbi, ichishandisa zvizere iyo yakakwirira yekupisa conductivity. yemhando yesimbi yezvinhu, kuderedza kubata kwemafuta kuramba.Asi kazhinji, roughness haifaniri kudiwa zvakanyanya.
3. Kuzadza kusarudzwa kwezvinhu
Kuti uderedze kupisa kwekupisa kweiyo yekubata kumeso kweiyo yepamusoro-simba chikamu chinokwira pamusoro uye kupisa sink, iyo interface insulation uye thermal conductivity zvinhu, thermal conductivity filler zvinhu zvine high thermal conductivity zvinofanirwa kusarudzwa, semuenzaniso, insulation uye thermal conductivity. zvinhu zvakadai seberyllium oxide (kana aluminium trioxide) ceramic sheet, polyimide firimu, mica sheet, zvinhu zvekuzadza senge thermally conductive silicone girisi, chimwe-chikamu vulcanized silicone rabha, maviri-chikamu thermally conductive silicone rabha, thermally conductive silicone rabha pad.
4. Installation kuonana pamusoro
Kuiswa pasina insulation: chikamu chinokwira pamusoro → kupisa singi inokwira kumusoro → PCB, maviri-layer yekubata kumeso.
Insulated kuisirwa: chikamu chinomisikidza pamusoro → kupisa sink inokwira kumusoro → insulation layer → PCB (kana chassis shell), matatu akaturikidzana enzvimbo yekusangana.Insulation layer yakaiswa mune iyo nhanho, inofanira kunge yakavakirwa pane chikamu chinokwira pamusoro kana PCB pamusoro pemagetsi ekudzivirira zvinodiwa.
Nguva yekutumira: Zvita-31-2021