Substrate kana yepakati layer chikamu chakakosha cheBGA package, iyo inogona kushandiswa kune impedance control uye inductor/resistor/capacitor yekubatanidza mukuwedzera kune interconnect wiring.Naizvozvo, iyo substrate zvinhu inodiwa kuve nepamusoro girazi shanduko tembiricha rS (inenge 175 ~ 230 ℃), yakakwira dimensional kugadzikana uye kuderera kwemwando kunyura, kuita kwakanaka kwemagetsi uye kuvimbika kwakanyanya.Metal firimu, insulation layer uye substrate media inofanirawo kunge iine yakakwirira adhesion zvivakwa pakati pavo.
1. The kurongedza muitiro mutobvu bonded PBGA
① Kugadzirira kwePBGA substrate
Laminate yakanyanya kutetepa (12 ~ 18μm mukobvu) foil yemhangura pamativi ese eBT resin/girazi musimboti bhodhi, wozoboora maburi uye kuburikidza-gomba simbi.Iyo yakajairwa PCB pamwe ne3232 maitiro anoshandiswa kugadzira magiraidhi pamativi ese e substrate, senge magidhi mitsetse, ma electrode, uye solder nzvimbo arrays ekukwirisa solder mabhora.Iyo solder mask inowedzerwa uye magirafu anogadzirwa kufumura ma electrode nenzvimbo dzekutengesa.Kuvandudza kugadzirwa kwekugadzira, substrate inowanzo ine akawanda PBG substrates.
② Packaging Process Flow
Wafer kutetepa → wafer kucheka → chip bonding → plasma kucheneswa → lead bonding → plasma kuchenesa → yakaumbwa pasuru → gungano remabhora ekutengesa → reflow oven solder → kumaka pamusoro → kupatsanura → kuongorora kwekupedzisira → bvunzo hopper kurongedza
Chip bonding inoshandisa sirivheri-yakazadzwa epoxy adhesive kubatanidza iyo IC chip kune substrate, ipapo goridhe waya yekubatanidza inoshandiswa kuona kubatana pakati pechip uye substrate, ichiteverwa neakaumbwa epurasitiki encapsulation kana liquid adhesive potting kuchengetedza chip, solder mitsara. uye pads.Chishandiso chakanyatsogadzirwa chinoshandiswa kuisa mabhora anotengeswa 62/36/2Sn/Pb/Ag kana 63/37/Sn/Pb ane nzvimbo inonyunguduka inosvika 183°C uye dhayamita re30 mil (0.75mm) Mapadhi, uye reflow soldering inoitwa muovheni yakajairwa reflow, ine tembiricha yekugadziridza isingapfuuri 230 ° C.Iyo substrate inozocheneswa centrifugally neCFC inorganic cleaner kuti ibvise solder uye fiber zvidimbu zvakasiiwa pasuru, zvichiteverwa nekumaka, kupatsanura, kuongorora kwekupedzisira, kuyedzwa, uye kurongedza kuchengetedza.Iri pamusoro ndiro kurongedza muitiro mutobvu bonding mhando PBGA.
2. Packaging process yeFC-CBGA
① Ceramic substrate
Iyo substrate yeFC-CBGA ndeye multilayer ceramic substrate, iyo yakaoma chaizvo kugadzira.Nekuti iyo substrate ine yakakwira wiring density, yakamanikana spacing, uye yakawanda kuburikidza nemakomba, pamwe nezvinodiwa coplanarity ye substrate yakakwirira.Yayo huru maitiro ndeiyi: chekutanga, iyo multilayer ceramic sheets inobatanidzwa pakupisa kwepamusoro kuti iite multilayer ceramic metallized substrate, ipapo iyo multilayer simbi wiring inogadzirwa pane substrate, uye ipapo plating inoitwa, etc. Mugungano reCBGA , iyo CTE mismatch pakati pe substrate uye chip uye PCB board ndiyo inonyanya kukonzera kutadza kwezvigadzirwa zveCBGA.Kuvandudza mamiriro aya, kuwedzera kune CCGA chimiro, imwe ceramic substrate, iyo HITCE ceramic substrate, inogona kushandiswa.
②Packaging process kuyerera
Kugadzirira kwema disc bumps -> disc kutema -> chip flip-flop uye reflow soldering -> kuzadzwa kwepasi kwemafuta ekupisa, kugovera kwekuisa chisimbiso solder -> capping -> kusangana kwemabhora ekutengesa -> reflow soldering -> kumaka -> kupatsanurwa -> kuongorora kwekupedzisira -> kuyedza -> kurongedza
3. Iyo yekurongedza maitiro ekutungamirira bonding TBGA
① TBGA inotakura tepi
Iyo inotakura tepi yeTBGA inowanzo gadzirwa ne polyimide zvinhu.
Mukugadzirwa, mativi ese ari maviri etepi inotakura anotanga kuvharwa nemhangura, kozoti nickel negoridhe rakaputirwa, richiteverwa nekurovera kuburikidza-gomba uye kuburikidza-gomba simbi uye kugadzirwa kwemifananidzo.Nekuti mune iyi lead yakasungirirwa TBGA, iyo yakavharidzirwa yekupisa sink zvakare yakavharidzirwa yakawedzera yakasimba uye yepakati cavity substrate yechubhu shell, saka tepi inotakura inosungirirwa kune inonyura yekupisa ichishandisa kumanikidza inonamira isati yaiswa.
② Encapsulation process flow
kutetepa chip → kucheka chip → chip bonding → kuchenesa → lead yekubatanidza → kuchenesa plasma → mvura inonamira poto → muunganidzwa wemabhora anotengeswa → reflow solder → kutara pamusoro → kupatsanura → kuongorora kwekupedzisira → kuongorora → kurongedza .
Zhejiang NeoDen Technology Co., LTD., yakavambwa muna 2010, inyanzvi inogadzira nyanzvi muSMT pick and place machine, reflow oven, stencil printing machine, SMT production line nezvimwe Zvigadzirwa zveSMT.
Isu tinotenda kuti vanhu vakuru uye vatinoshanda navo vanoita NeoDen kambani hombe uye kuti kuzvipira kwedu kune Innovation, Diversity uye Sustainability inovimbisa kuti SMT otomatiki inowanikwa kune wese hobbyist pese pese.
Wedzera: No.18, Tianzihu Avenue, Tianzihu Town, Anji County, Huzhou City, Zhejiang Province, China
Nharembozha: 86-571-26266266
Nguva yekutumira: Feb-09-2023