Yepamberi yekurongedza ndeimwe yeakanakisa tekinoroji e 'More than Moore' era.Sezvo machipisi ari kuwedzera kuoma uye kudhura kuita miniaturise pane yega yega process node, mainjiniya ari kuisa akawanda machipisi mumapakeji epamberi kuitira kuti asazonetsekana kuadzikisa.Ichi chinyorwa chinopa sumo pfupi kune gumi emashoko anonyanya kushandiswa muhunyanzvi hwekurongedza.
2.5D mapakeji
Iyo 2.5D package ndeyekufambira mberi kwechinyakare 2D IC yekurongedza tekinoroji, inobvumira mutsara wakatsetseka uye kushandiswa kwenzvimbo.Mupakeji ye2.5D, kufa kwakashama kwakaturikidzana kana kuiswa padivi-ne-parutivi pamusoro peiyo interposer layer ine silicon kuburikidza vias (TSVs).Iyo base, kana interposer layer, inopa kubatana pakati pemachipi.
Iyo 2.5D package inowanzo shandiswa kune yepamusoro-yekupedzisira ASICs, FPGAs, GPUs uye memory cubes.2008 yakaona Xilinx ichikamura maFPGA ayo makuru kuita machipisi mana ane goho repamusoro uye obatanidza aya kune silicon interposer layer.2.5D mapakeji akazvarwa uye akazoshandiswa zvakanyanya kune yakakwira bandwidth memory (HBM) processor yekubatanidza.
Dhizaini ye 2.5D package
3D kurongedza
Mune 3D IC package, logic inofa yakarongedzerwa pamwe chete kana nekuchengetedza kufa, kubvisa kudiwa kwekuvaka yakakura System-on-Chips (SoCs).Iyo inofa yakabatana kune imwe neimwe neanoshanda interposer layer, nepo 2.5D IC mapakeji anoshandisa conductive bumps kana TSVs kurongedza zvikamu paiyo interposer layer, 3D IC mapakeji anobatanidza akawanda akaturikidzana esilicon wafers kune zvikamu zvinoshandisa TSVs.
TSV tekinoroji ndiyo kiyi inogonesa tekinoroji mune ese 2.5D uye 3D IC mapakeji, uye iyo semiconductor indasitiri yanga ichishandisa HBM tekinoroji kugadzira DRAM machipisi mumapakeji e3D IC.
Iyo muchinjika-chikamu maonero eiyo 3D package inoratidza kuti yakatwasuka yekubatanidza pakati pesilicon machipisi inowanikwa kuburikidza nesimbi yemhangura TSVs.
Chiplet
Chiplets ndeimwe fomu ye3D IC yekurongedza iyo inogonesa iyo heterogeneous kubatanidzwa kweCMOS uye isiri-CMOS zvikamu.Mune mamwe mazwi, iwo madiki maSoCs, anonziwo machiplets, pane maSoC akakura mupakeji.
Kupwanya SoC hombe kuita madiki, machipisi madiki anopa goho repamusoro uye mitengo yakaderera pane imwe chete isina kufa.machiplets anobvumira vagadziri kutora mukana weiyo yakawanda IP pasina kufunga kuti ndeipi nzira yekushandisa uye ndeipi tekinoroji yekushandisa kuigadzira.Vanogona kushandisa zvinhu zvakasiyana-siyana, kusanganisira silicon, girazi uye laminates kugadzira chip.
Chiplet-yakavakirwa masisitimu inoumbwa neakawanda maChiplets pane yepakati layer
Fan Out Packages
MuFan Out package, iyo "yekubatanidza" inopepetwa kubva pamusoro pechip kuti ipe imwe yekunze I/O.Inoshandisa epoxy molding material (EMC) iyo yakanyudzwa zvizere mufa, ichibvisa kudiwa kwemaitiro akadai sewafer bumping, fluxing, flip-chip mounting, kuchenesa, kupfapfaidza pasi uye kurapa.Naizvozvo, hapana yepakati layer inodiwa chero, zvichiita kuti heterogeneous kusanganisa kuve nyore.
Fan-out tekinoroji inopa diki pasuru ine yakawanda I/O pane mamwe marudzi epasuru, uye muna 2016 yaive nyeredzi tekinoroji apo Apple yakakwanisa kushandisa tekinoroji yekurongedza yeTSMC kubatanidza 16nm application processor uye nhare yeDRAM mupakeji imwe chete ye iPhone. 7.
Fan-out packaging
Fan-Out Wafer Level Packaging (FOWLP)
Tekinoroji yeFOWLP ndeye kunatsiridza pawafer-level packaging (WLP) inopa mamwe ekunze kubatana kwesilicon chips.Inosanganisira kunyudza chip mune epoxy molding zvinhu uyezve kuvaka yakakwira density redistribution layer (RDL) pane wafer pamusoro uye kushandisa solder mabhora kuti agadzire wafer akagadziridzwa.
FOWLP inopa huwandu hukuru hwekubatanidza pakati pepakeji uye bhodhi rekushandisa, uye nekuti iyo substrate yakakura pane iyo inofa, iyo yekufa inonyatso kuzorora.
Muenzaniso weFOWLP package
Kubatanidzwa kwakasiyana-siyana
Kubatanidzwa kwezvikamu zvakasiyana-siyana zvinogadzirwa zvakasiyana mumagungano epamusoro-soro zvinogona kuwedzera kushanda uye kuvandudza maitiro ekushanda, saka semiconductor component vagadziri vanokwanisa kusanganisa zvikamu zvinoshanda nemaitiro akasiyana-siyana anoyerera mumusangano mumwe chete.
Heterogeneous integration yakafanana ne-system-in-package (SiP), asi panzvimbo yekubatanidza akawanda asina kufa pane imwe substrate, inobatanidza ma IP akawanda nenzira yeChiplets pane imwe substrate.Pfungwa yekutanga yekubatanidza heterogeneous ndeye kusanganisa akawanda mazvikamu ane akasiyana mabasa mupakeji imwechete.
Zvimwe zvidhinha zvekuvaka zvehunyanzvi mukubatanidzwa kwakasiyana
HBM
HBM ndeye yakamisikidzwa stack yekuchengetedza tekinoroji inopa yakakwira bandwidth chiteshi che data mukati me stack uye pakati pekuyeuka uye zvine musoro zvikamu.HBM mapakeji stack memory anofa uye oabatanidza pamwe chete kuburikidza neTSV kugadzira yakawanda I/O uye bandwidth.
HBM chiyero cheJEDEC chinosanganisa zvakamira akati wandei ezvikamu zveDRAM mukati mepakeji, pamwe chete nemapurosesa ekushandisa, maGPU uye maSoCs.HBM inonyanya kushandiswa se 2.5D package yemasevha ekupedzisira uye networking chips.Iyo HBM2 kuburitswa ikozvino inogadzirisa kugona uye wachi chiyero chekugumira kwekutanga kuburitswa kweHBM.
HBM mapakeji
Intermediate Layer
Iyo interposer layer ndiyo nzira iyo masaini emagetsi anopfuudzwa kubva kune yakawanda-chip bare die kana bhodhi mupakeji.Ndiyo yemagetsi interface pakati pezvigadziko kana zvibatanidza, zvichibvumira masaini kuti aendeswe mberi uye akabatanidzwa kune mamwe masokisi pabhodhi.
Iyo interposer layer inogona kugadzirwa nesilicon uye organic zvinhu uye inoita sebhiriji pakati peakawanda-anofa kufa uye bhodhi.Silicon interposer layers itekinoroji yakapupurirwa ine yakakwira yakanaka pitch I/O density uye TSV kuumba kugona uye inoita basa rakakosha mu2.5D uye 3D IC chip kurongedza.
Kuitwa kwakajairika kwehurongwa hwakapatsanurwa pakati pepakati
Redistribution layer
Iyo redistribution layer ine copper yekubatanidza kana magadzirirwo ayo anogonesa kubatana kwemagetsi pakati pezvikamu zvakasiyana zvepasuru.Iyo dhizaini yesimbi kana yepolymeric dielectric zvinhu zvinogona kurongedzerwa mupakeji isina kufa, nekudaro ichidzikisa nzvimbo yeI / O yemachipset makuru.Redistribution layers yave chikamu chakakosha che 2.5D uye 3D pasuru mhinduro, zvichibvumira machipi ari paari kuti ataurirane nemumwe achishandisa yepakati.
Integrated mapakeji vachishandisa redistribution layers
TSV
TSV ndiyo yakakosha yekumisikidza tekinoroji ye2.5D uye 3D yekurongedza mhinduro uye iwafer-yakazadzwa nemhangura inopa yakatwasuka yekubatanidza kuburikidza nesilicon wafer kufa.Iyo inomhanya nepakati pese kufa kuti ipe chinongedzo chemagetsi, ichigadzira nzira pfupi kubva kune rimwe divi rekufa kuenda kune rimwe.
Kuburikidza-maburi kana vias akaiswa kune imwe kudzika kubva kudivi remberi kwechimedu, icho chinozoiswa insulated uye kuzadzwa nekuisa conductive zvinhu (kazhinji mhangura).Kamwe chip inogadzirwa, iyo yakatetepa kubva kumashure kwechimedu kuti ifumure vias uye simbi inoiswa kumashure kwechimedu kuti ipedze TSV interconnect.
Nguva yekutumira: Jul-07-2023