Kuiswa kweAnti-deformation yezvikamu zvakadhindwa zvebhodhi redunhu

1. Mune yekusimbisa furemu uye PCBA kuisirwa, PCBA uye chassis yekumisikidza maitiro, iyo yakamonyoroka PCBA kana warped reinforcement furemu kuisirwa kwakananga kana kumanikidzirwa kuisirwa uye PCBA kuisirwa mune yakaremara chassis.Kuisa kushushikana kunokonzera kukuvadzwa uye kutsemuka kwechikamu chinotungamira (kunyanya yakakwira density ICs seBGS uye pamusoro peiyo mount components), relay maburi e-multi-layer PCBs uye mitsara yemukati yekubatanidza uye mapadhi e-multi-layer PCBs.Kuwarpeji haizadzise zvinodiwa nePCBA kana yakasimbiswa furemu, mugadziri anofanira kushandirapamwe nenyanzvi asati agadzika muhuta hwayo (akamonyoroka) zvikamu kutora kana kugadzira zvinobudirira "pedhi" matanho.

2. Ongororo

a.Pakati pe chip capacitive components, mukana wekukanganisa mu ceramic chip capacitors ndiyo yakakwirira, kunyanya inotevera.

b.PCBA kukotama uye deformation inokonzerwa nekushushikana kwekuiswa kwewaya bundle.

c.Flatness yePCBA mushure mekutengesa yakakura kupfuura 0.75%.

d.Asymmetric dhizaini yemapadhi pamativi ese eceramic chip capacitors.

e.Utility pads ane soldering nguva yakakura kupfuura 2s, soldering tembiricha yakakwira kupfuura 245 ℃, uye yakazara nguva yekutengesa inodarika kukosha kwakatarwa ka6.

f.Yakasiyana yekupisa yekuwedzera coefficient pakati peceramic chip capacitor uye PCB zvinhu.

g.PCB dhizaini ine maburi ekugadzirisa uye ceramic chip capacitors iri padyo zvakanyanya kune mumwe nemumwe inokonzera kushushikana kana kutsanya, nezvimwe.

h.Kunyangwe iyo ceramic chip capacitor ine saizi yepedhi paPCB, kana huwandu hwekutengesa hwakawandisa, huchawedzera kushushikana kweiyo chip capacitor kana PCB yakakotama;iyo chaiyo chiyero che solder inofanira kunge iri 1/2 kusvika 2/3 yehurefu hweiyo solder yekupedzisira yechip capacitor.

i.Chero ekunze mechanika kana kupisa kushushikana kunokonzeresa kutsemuka muceramic chip capacitors.

• Kutsemuka kunokonzerwa neextrusion yekukwira pikicha uye kuisa musoro kucharatidza kumusoro kwechikamu, kazhinji seyakatenderera kana hafu-yemwedzi yakavezwa kutsemuka nekuchinja kwemavara, mukati kana pedyo nepakati pe capacitor.
• Kutsemuka kunokonzerwa nezvisina kunaka marongero etora uye isa muchinaparameters.Iyo yekunhonga-ne-nzvimbo yemusoro wekukwira inoshandisa vacuum suction chubhu kana yepakati clamp kuisa chikamu, uye yakawandisa Z-axis yekudzika yekumanikidza inogona kutyora iyo ceramic chikamu.Kana simba rakakura rakakwana rinoshandiswa kunhonga uye kuisa musoro pane imwe nzvimbo kunze kwepakati pemuviri weceramic, kushungurudzika kunoshandiswa kune capacitor kunogona kunge kwakakura zvakakwana kukuvadza chikamu.
• Kusarudzwa kwakashata kwehukuru hwe chip pick uye kuisa musoro kunogona kukonzera kuputika.Iyo dhayamita diki tora uye isa musoro inotarisisa simba rekuisa panguva yekuiswa, zvichikonzera diki ceramic chip capacitor nzvimbo kuti iite kushushikana kukuru, zvichikonzera kutsemuka kweceramic chip capacitors.
• Kusaenderana kuwanda kwe solder kunoburitsa kusagadzikana kwekushushikana kwekugovera pane chikamu, uye kune imwe mugumo kuchasimbisa kusungirirwa uye kuputika.
• Mhedzisiro yekutsemuka ndeye porosity uye kuputika pakati pezvikamu zveceramic chip capacitors uye ceramic chip.

3. Solution zviyero.

Simbisa kutariswa kweceramic chip capacitors: Iyo ceramic chip capacitors inotariswa neC-type scanning acoustic microscope (C-SAM) uye scanning laser acoustic microscope (SLAM), iyo inogona kuvharidzira yakaremara ceramic capacitors.