110 ruzivo mapoinzi eSMT chip kugadzirisa - Chikamu 1

110 ruzivo mapoinzi eSMT chip kugadzirisa - Chikamu 1

1. Kazhinji, tembiricha yeSMT chip processing workshop i25 ± 3 ℃;
2. Zvishandiso uye zvinhu zvinodiwa pakudhinda paste paste, senge solder paste, steel plate, scraper, pepa rekupukuta, pepa risina huruva, detergent nebanga rekusanganisa;
3. Yakajairika kuumbwa kwe solder paste alloy is Sn / Pb alloy, uye alloy share ndeye 63/37;
4. Pane zvikamu zviviri zvikuru mu solder paste, zvimwe itin powder uye flux.
5. Basa rekutanga rekuyerera muwelding ndeyekubvisa oxide, kukuvadza kunze kwekunze kwetani yakanyungudutswa uye kudzivirira reoxidation.
6. Kuwanda kwehuwandu hwetin powder particles kusvika kune 1: 1 uye chikamu chechikamu chinenge 9: 1;
7. Nheyo ye solder paste ndeyekutanga mune yekutanga kunze;
8. Kana iyo solder paste inoshandiswa muKaifeng, inofanira kunge ichidziya uye inosanganiswa kuburikidza nemaitiro maviri anokosha;
9. Nzira dzakajairika dzekugadzira simbi ndiro: etching, laser uye electroforming;
10. Zita rakazara reSMT chip processing is surface mount (kana kukwira) tekinoroji, zvinoreva kutaridzika kwekunamatira (kana kukwira) tekinoroji muchiChinese;
11. Zita rakazara reESD rinonzi electro static discharge, zvinoreva kuti electrostatic discharge muchiChinese;
12. Paunenge uchigadzira chirongwa cheSMT michina, purogiramu inosanganisira zvikamu zvishanu: data yePCB;mark data;feeder data;puzzle data;chikamu data;
13. Nzvimbo yakanyunguduka yeSn / Ag / Cu 96.5 / 3.0 / 0.5 ndeye 217c;
14. The kushanda hama tembiricha uye mwando yezvikamu kuomesa oveni iri <10%;
15. Passive midziyo inowanzoshandiswa inosanganisira kuramba, capacitance, point inductance (kana diode), nezvimwewo;zvishandiso zvinoshanda zvinosanganisira transistors, IC, nezvimwe;
16. Chigadzirwa chesimbi chinowanzo shandiswa SMT ndiro isimbi isina tsvina;
17. Ukobvu hweinowanzo shandiswa SMT simbi ndiro 0.15mm (kana 0.12mm);
18. Mhando dzekuchaja kwemagetsi dzinosanganisira kukakavara, kupatsanura, induction, electrostatic conduction, zvichingodaro;pesvedzero yekuchaja kwemagetsi paindasitiri yemagetsi ndiko kutadza kweESD uye kusvibiswa kwemagetsi;misimboti mitatu yekubvisa magetsi ndeye electrostatic neutralization, grounding uye shielding.
19. Kureba x upamhi hwechirungu system ndeye 0603 = 0.06inch * 0.03inch, uye iyo metric system ndeye 3216 = 3.2mm * 1.6mm;
20. Code 8 "4" ye erb-05604-j81 inoratidza kuti kune 4 masekete, uye kukosha kwekudzivirira ndeye 56 ohm.Iyo capacitance ye eca-0105y-m31 ndeye C = 106pf = 1NF = 1 × 10-6f;
21. Zita rakazara rechiChinese reECN inyanzvi yekuchinja kweinjiniya;zita rakazara reChinese reSWR nderokuti: kurongeka kwebasa rine zvinodiwa zvakakosha, izvo zvinodiwa kuti zvisainane nemadhipatimendi akakodzera uye kugoverwa pakati, izvo zvinobatsira;
22. Izvo zvakananga zviri mukati me5S kuchenesa, kuronga, kuchenesa, kuchenesa uye kunaka;
23. Chinangwa chePCB vacuum packaging ndechekudzivirira guruva uye unyoro;
24. Mutemo wehutano ndewekuti: kutonga kwehutano hwose, kutevera maitiro, kupa hutano hunodiwa nevatengi;mutemo wekutora chikamu zvizere, kubata nenguva, kuwana zero defect;
25. Mitemo mitatu isina kunaka ndeiyi: kusagamuchirwa kwezvinhu zvakakanganisika, kusagadzirwa kwezvinhu zvakakanganisika uye kusabuda kwezvinhu zvakakanganisika;
26. Pakati penzira nomwe dzeQC, 4m1h inoreva (Chinese): munhu, muchina, zvinhu, nzira uye zvakatipoteredza;
27. Kuumbwa kwe solder paste kunosanganisira: metal powder, Rongji, flux, anti vertical flow agent uye inoshanda mumiririri;maererano nechikamu chacho, iyo simbi poda inoverengera 85-92%, uye vhoriyamu yakakosha simbi poda account ye50%;pakati pavo, zvikamu zvikuru zvehupfu hwesimbi itini uye mutobvu, mugove uri 63/37, uye nzvimbo yakanyunguduka i183 ℃;
28. Paunenge uchishandisa solder paste, zvakakosha kuitora kunze kwefiriji kuitira kupora kwekushisa.Chinangwa ndechekuita kuti tembiricha ye solder paste idzokere kune yakajairika tembiricha kuti idhindwe.Kana tembiricha isina kudzoserwa, iyo solder bead iri nyore kuitika mushure mePCBA inopinda reflow;
29. Mafomu ekupa magwaro emuchina anosanganisira: fomu yekugadzirira, fomu yekukurukurirana inokosha, fomu yekukurukurirana uye fomu yekubatanidza nokukurumidza;
30. Nzira dzekuisa PCB dzeSMT dzinosanganisira: Vacuum positioning, mechanical hole positioning, double clamp positioning uye board edge positioning;
.
32. Silk screen kudhinda paBGA muviri kunosanganisira mugadziri, mugadziri chikamu nhamba, mwero uye Datecode / (mujenya no);
33. Pitch ye208pinqfp ndeye 0.5mm;
34. Pakati penzira nomwe dzeQC, diagram yehove inotarisa pakutsvaga hukama hunokonzera;
37. CPK inoreva kugona kwemaitiro pasi pekuita kwazvino;
38. Flux yakatanga kubuda munzvimbo inogara tembiricha yekuchenesa makemikari;
39. Yakanakira kutonhora zone curve uye reflux zone curve mifananidzo yegirazi;
40. RSS curve iri kudziyisa → tembiricha isingachinji → reflux → kutonhora;
41. Nyaya yePCB yatiri kushandisa iFR-4;
42. PCB warpage standard haipfuure 0.7% yediagonal yayo;
43. Laser incision yakaitwa ne stencil inzira inogona kudzokororwa;
44. Iyo dhayamita yeBGA bhora rinowanzoshandiswa pabhodhi guru rekombiyuta ndeye 0.76mm;
45. ABS system yakanaka kurongedza;
46. ​​Iko kukanganisa kweceramic chip capacitor eca-0105y-k31 ndeye ± 10%;
47. Panasert Matsushita yakazara inoshanda Mounter ine voltage ye 3?200 ± 10vac;
48. Kune SMT zvikamu zvekurongedza, dhayamita ye tepi reel ndeye 13 inches uye 7 inches;
49. Kuvhurwa kweSMT kunowanzoita 4um diki pane yePCB pad, iyo inogona kudzivirira kutaridzika kwebhora rakashata solder;
50. Maererano nemitemo yekuongorora yePCBA, kana dihedral angle inopfuura madhigirii makumi mapfumbamwe, inoratidza kuti solder paste haina kunamatira kune wave solder body;
51. Mushure mokunge IC yakasunungurwa, kana hunyoro huri pakadhi hwakakura kudarika 30%, inoratidza kuti IC yakanyorova uye hygroscopic;
52. Yakarurama chikamu reshiyo uye vhoriyamu reshiyo reti upfu kuti flux mu solder paste ari 90%: 10%, 50%: 50%;
53. Unyanzvi hwekubatanidza hunoonekwa hwepakutanga hwakabva kumauto neAvionics minda pakati pemakore ekuma1960;
54. Zviri mukati meSn nePb mune solder paste izvo zvinonyanya kushandiswa muSMT zvakasiyana.


Nguva yekutumira: Sep-29-2020

Tumira meseji yako kwatiri: