11. Kushungurudzika-sensitive components hazvifaniri kuiswa pamakona, kumativi, kana pedyo nekubatanidza, maburi ekukwira, grooves, cutouts, gashes uye makona emapuranga akadhindwa edunhu.Nzvimbo idzi inzvimbo dzakanyanya kushushikana dzemapuranga edunhu akadhindwa, ayo anogona kukonzera kutsemuka kana kutsemuka mumajoini e solder uye zvikamu.
12. Kurongeka kwezvikamu kuchasangana nemaitiro uye nzvimbo inodiwa ye reflow soldering uye wave soldering.Inoderedza mumvuri maitiro panguva ye wave soldering.
13. Yakadhindwa maburi ekuisa bhodhi redunhu uye tsigiro yakagadziriswa inofanira kuiswa parutivi kuti itore chinzvimbo.
14. Mukugadzirwa kwenzvimbo huru yakadhindwa redunhu bhodhi rinopfuura 500cm2, kuitira kudzivirira bhodhi redunhu rakadhindwa kuti rirege kukotama pakuyambuka choto cherata, gaka re5 ~ 10mm rakafara rinofanira kusiiwa pakati pebhodhi redunhu rakadhindwa, uye zvikamu (zvinogona kufamba) hazvifanirwe kuiswa, kuitira kudzivirira bhodhi redunhu rakadhindwa kubva pakukotama pakuyambuka choto cherata.
15. The component layout direction ye reflow soldering process.
（1） Iyo dhizaini yekumisikidza yezvikamu inofanira kufunga nezvekutungamira kweiyo yakadhindwa redunhu bhodhi muchoto chekuyerera.
(2) kuitira kuti iite iyo miviri yekupedzisira ye chip mativi pamativi ese e weld end uye SMD zvikamu pamativi ese epini synchronization inopisa, kuderedza zvikamu pamativi ese ekupedzisira welding hazviburitse erection, chinja. , synchronous kupisa kubva kune welding kuremara senge solder welding end, inoda magumo maviri e chip components pane yakadhindwa redunhu bhodhi refu axis inofanira kunge iri perpendicular kune kutungamira kwebhandi rekutakura revheni reflow.
(3) Iyo yakareba axis yezvikamu zveSMD inofanira kuenzana nekufambisa kutungamira kwevira reflow.Iyo yakareba axis yeCHIP zvikamu uye iyo yakareba axis yeSMD zvikamu pamagumo ose anofanira kunge ari perpendicular kune mumwe nemumwe.
(4) Yakanaka dhizaini dhizaini yezvikamu haifanire kungofunga nezvekufanana kwekupisa kwesimba, asi zvakare funga kutungamira uye kutevedzana kwezvikamu.
(5) Kune yakakura saizi yakadhindwa redunhu bhodhi, kuitira kuchengetedza tembiricha pamativi ese eiyo yakadhindwa redunhu bhodhi inopindirana sezvinobvira, rutivi rurefu rweakadhindwa redunhu bhodhi rinofanira kuenderana negwara rebhandi rekutakura reflow. choto.Naizvozvo, kana yakadhindwa redunhu bhodhi saizi yakakura kupfuura 200mm, zvinodiwa ndezvizvi:
(A) iyo yakareba axis yeCHIP chikamu pamigumo yese iri perpendicular kudivi refu reakadhindwa redunhu bhodhi.
(B) Iyo yakareba axis yechikamu cheSMD inofanana nerutivi rurefu rwebhodhi redunhu rakadhindwa.
(C)Kune bhodhi redunhu rakadhindwa rakaunganidzwa pamativi ese, zvikamu pamativi ese zvine kutaridzika kwakafanana.
(D)Ronga nzira yezvikamu pabhodhi redunhu rakadhindwa.Zvikamu zvakafanana zvinofanirwa kurongeka munzira imwechete sezvinobvira, uye hunhu hunofanirwa kunge hwakafanana, kuitira kuti kugonesa kuiswa, welding uye kuona kwezvikamu.Kana electrolytic capacitor positive pole, diode positive pole, transistor single pini inopera, pini yekutanga yeintegrated circuit marongerwo nzira inopindirana sezvinobvira.
16. Kuti udzivise kupfupika kwepakati pakati pezvikamu zvinokonzerwa nekubata tambo yakadhindwa panguva yePCB yekugadzirisa, iyo conductive pateni yemukati yemukati uye yekunze layer inofanira kunge inopfuura 1.25mm kubva kuPCB kumucheto.Kana tambo yepasi yakaiswa pamucheto wekunze kwePCB, waya yepasi inogona kutora nzvimbo yekumucheto.Kune nzvimbo dzePCB dzepamusoro dzakagarwa nekuda kwezvinodiwa zvekuumbwa, zvikamu uye zvakadhindwa makondukita hazvifanirwe kuiswa munzvimbo yepasi solder pad ye SMD/SMC pasina nemaburi, kuitira kudzivirira kutsauka kwe solder mushure mekupisa uye kunyungudika mumafungu. soldering mushure me reflow soldering.
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Nguva yekutumira: Zvita-21-2020